| 11929729 |
Wafer level package and method of manufacture |
— |
2024-03-12 |
| 10381277 |
Method for producing a plurality of measurement regions on a chip, and chip with measurement regions |
Heinz Schoeder |
2019-08-13 |
| 9999120 |
Circuit carrier having a conducting path and an electric shield |
Florian Poprawa, Christina Schindler, Jörg Zapf |
2018-06-12 |
| 9887339 |
Infrared sensor, thermal imaging camera and method for producing a microstructure from thermoelectric sensor rods |
Harry Hedler, Ingo Kuehne, Joerg Zapf |
2018-02-06 |
| 9735072 |
Method for producing a plurality of measurement regions on a chip, and chip with measurement regions |
Heinz Schoeder |
2017-08-15 |
| 9442379 |
Method for producing a microscreen |
Susanne Kornely, Daniel Sickert |
2016-09-13 |
| 9421500 |
Method for producing a microscreen |
Susanne Kornely, Daniel Sickert |
2016-08-23 |
| 9170226 |
Micromechanical substrate for a diaphragm with a diffusion barrier layer |
Maximilian Fleischer, Oliver Freudenberg, Harry Hedler, Manfred Schreiner, Karl Weidner +2 more |
2015-10-27 |