Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062983 | Creation of porosity in low-k films by photo-disassociation of imbedded nanoparticles | Nerissa Draeger | 2011-11-22 |
| 7972976 | VLSI fabrication processes for introducing pores into dielectric materials | Willibrordus Gerardus Maria van den Hoek, Nerissa Draeger, Raashina Humayun, Richard S. Hill, Jianing Sun | 2011-07-05 |
| 7629224 | VLSI fabrication processes for introducing pores into dielectric materials | Willibrordus Gerardus Maria van den Hoek, Nerissa Draeger, Raashina Humayun, Richard S. Hill, Jianing Sun | 2009-12-08 |
| 7166531 | VLSI fabrication processes for introducing pores into dielectric materials | Willibrordus Gerardus Maria van den Hoek, Nerissa Draeger, Raashina Humayun, Richard S. Hill, Jianing Sun | 2007-01-23 |
| 6759724 | Isolation of alpha silicon diode sensors through ion implantation | Min Cao, Jeremy Alfred Theil, Dietrich W. Vook | 2004-07-06 |
| 6586812 | Isolation of alpha silicon diode sensors through ion implantation | Min Cao, Jeremy Alfred Theil, Dietrich W. Vook | 2003-07-01 |
| 6396118 | Conductive mesh bias connection for an array of elevated active pixel sensors | Jeremy Alfred Theil, Jane M. Lin, Min Cao, Shawming Ma, Xin Sun | 2002-05-28 |
| 6387736 | Method and structure for bonding layers in a semiconductor device | Min Cao, Jeremy Alfred Theil, Dietrich W. Vook | 2002-05-14 |
| 6281535 | Three-dimensional ferroelectric capacitor structure for nonvolatile random access memory cell | Shawming Ma, Florence Eschbach | 2001-08-28 |
| 6215164 | Elevated image sensor array which includes isolation between uniquely shaped image sensors | Min Cao, Jeremy Alfred Theil, Dietrich W. Vook, Shawming Ma | 2001-04-10 |
| 6114739 | Elevated pin diode active pixel sensor which includes a patterned doped semiconductor electrode | Jeremy Alfred Theil, Min Cao, Dietrich W. Vook, Frederick Perner, Xin Sun +4 more | 2000-09-05 |
| 6083572 | Organic low-dielectric constant films deposited by plasma enhanced chemical vapor deposition | Jeremy Alfred Theil, Karen L. Seaward, Francoise F. Mertz | 2000-07-04 |
| 6051867 | Interlayer dielectric for passivation of an elevated integrated circuit sensor structure | Jeremy Alfred Theil, Frederick Perner, Min Cao | 2000-04-18 |
| 6027995 | Method for fabricating an interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Vicky Ochoa, Sychyi Fang, David B. Fraser +2 more | 2000-02-22 |
| 6018187 | Elevated pin diode active pixel sensor including a unique interconnection structure | Jeremy Alfred Theil, Min Cao, Dietrich W. Vook, Frederick Perner, Xin Sun +1 more | 2000-01-25 |
| 6016011 | Method and apparatus for a dual-inlaid damascene contact to sensor | Min Cao, Jeremy Alfred Theil, Dietrich W. Vook | 2000-01-18 |
| 5886410 | Interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Vicky Ochoa, Sychyi Fang, David B. Fraser +2 more | 1999-03-23 |
| 5342808 | Aperture size control for etched vias and metal contacts | Kristen Brigham | 1994-08-30 |
| 5200360 | Method for reducing selectivity loss in selective tungsten deposition | Donald R. Bradbury | 1993-04-06 |