Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8455983 | Microelectronic device wafers and methods of manufacturing | Alan G. Wood, Ed A. Schrock | 2013-06-04 |
| 8062958 | Microelectronic device wafers and methods of manufacturing | Alan G. Wood, Ed A. Schrock | 2011-11-22 |
| 7811903 | Thin flip-chip method | Timothy L. Jackson | 2010-10-12 |
| 7557452 | Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same | Vernon Williams, Bret K. Street | 2009-07-07 |
| 7291543 | Thin flip-chip method | Timothy L. Jackson | 2007-11-06 |
| 7189600 | Methods for fabricating stiffeners for flexible substrates | — | 2007-03-13 |
| 7170171 | Support ring for use with a contact pad and semiconductor device components including the same | — | 2007-01-30 |
| 7138724 | Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask | William Reeder | 2006-11-21 |
| 7134390 | Method and stencil for extruding material on a substrate | Chad A. Cobbley | 2006-11-14 |
| 7125748 | Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask | William Reeder | 2006-10-24 |
| 7122905 | Microelectronic devices and methods for mounting microelectronic packages to circuit boards | — | 2006-10-17 |
| 7115981 | Semiconductor device assemblies including interposers with dams protruding therefrom | — | 2006-10-03 |
| 7109106 | Methods for providing support for conductive structures protruding from semiconductor device components | — | 2006-09-19 |
| 7064002 | Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers | — | 2006-06-20 |
| 7041532 | Methods for fabricating interposers including upwardly protruding dams | — | 2006-05-09 |
| 7029954 | Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | — | 2006-04-18 |
| 6984545 | Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask | William Reeder | 2006-01-10 |
| 6979888 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2005-12-27 |
| 6939501 | Methods for labeling semiconductor device components | James M. Ocker, Rick A. Leininger | 2005-09-06 |
| 6926191 | Process for fabricating external contacts on semiconductor components | Kenneth Glover | 2005-08-09 |
| 6905946 | Thin flip-chip method | Timothy L. Jackson | 2005-06-14 |
| 6902995 | Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad | — | 2005-06-07 |
| 6900078 | Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | — | 2005-05-31 |
| 6882049 | Support ring for use with a contact pad and semiconductor device components including the same | — | 2005-04-19 |
| 6854633 | System with polymer masking flux for fabricating external contacts on semiconductor components | Kenneth Glover | 2005-02-15 |