Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184237 | Surface-mount amplifier devices | Lu Ll, Li Ll, Lakshminarayan Viswanathan, Zhiwei Gong, Elie A. Maalouf +1 more | 2024-12-31 |
| 12040291 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | Zhiwei Gong, Li Li, Lu Li, Lakshminarayan Viswanathan, Burton J. Carpenter | 2024-07-16 |
| 11984429 | Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof | Yun Wei, Scott D. Marshall, Lakshminarayan Viswanathan, Taek Kyu Kim, Ricardo Uscola | 2024-05-14 |
| 11621231 | Methods of fabricating leadless power amplifier packages including topside terminations | Yun Wei, Lakshminarayan Viswanathan, Scott D. Marshall | 2023-04-04 |
| 11581241 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures | Boon Yew Low, Li Li, Fui Yee Lim, Lan Chu Tan | 2023-02-14 |
| 11437276 | Packaged dies with metal outer layers extending from die back sides toward die front sides | Jaynal A. Molla, Lakshminarayan Viswanathan, David F. Abdo, Colby Greg Rampley | 2022-09-06 |
| 11342275 | Leadless power amplifier packages including topside terminations and methods for the fabrication thereof | Yun Wei, Lakshminarayan Viswanathan, Scott D. Marshall | 2022-05-24 |
| 11343919 | Packaged electronic devices with top terminations | Audel A. Sanchez, Lakshminarayan Viswanathan, Jerry L. White | 2022-05-24 |
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Jaynal A. Molla, Lakshminarayan Viswanathan, David F. Abdo, Colby Greg Rampley | 2020-08-11 |
| 10630243 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Mahesh K. Shah | 2020-04-21 |
| 10529638 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2020-01-07 |
| 10476442 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Mahesh K. Shah | 2019-11-12 |
| 10396006 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2019-08-27 |
| 10375833 | Methods of manufacturing packaged electronic devices with top terminations | Lakshminarayan Viswanathan, Audel A. Sanchez, Jerry L. White | 2019-08-06 |
| 10199303 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2019-02-05 |
| 10199302 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Jaynal A. Molla | 2019-02-05 |
| 10110170 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Mahesh K. Shah | 2018-10-23 |
| 9986646 | Packaged electronic devices with top terminations, and methods of manufacture thereof | Lakshminarayan Viswanathan, Audel A. Sanchez, Jerry L. White | 2018-05-29 |
| 9800208 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez +1 more | 2017-10-24 |
| 9466588 | Method and apparatus for multi-chip structure semiconductor package | Audel A. Sanchez, Lakshminarayan Viswanathan | 2016-10-11 |
| 9450547 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Mahesh K. Shah | 2016-09-20 |
| 9337774 | Packaged RF amplifier devices and methods of manufacture thereof | Margaret A. Szymanowski, L. M. Mahalingam, Sarmad K. Musa, Jerry L. White | 2016-05-10 |
| 9300254 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez +1 more | 2016-03-29 |
| 9263375 | System, method and apparatus for leadless surface mounted semiconductor package | Lakshminarayan Viswanathan, Lakshmi N. Ramanathan, Audel A. Sanchez | 2016-02-16 |
| 9236363 | Wedge bond foot jumper connections | Jeffrey K. Jones, Basim Noori, Mohd Salimin Sahludin | 2016-01-12 |