Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11440158 | Coated compressive subpad for chemical mechanical polishing | Paul Andre Lefevre | 2022-09-13 |
| 10946495 | Low density polishing pad | Ping Huang, William C. Allison, Richard L. Frentzel, Paul Andre Lefevre, Robert Kerprich | 2021-03-16 |
| 10293459 | Polishing pad having polishing surface with continuous protrusions | Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Ping Huang, Leslie M. Charns +2 more | 2019-05-21 |
| 10160092 | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls | Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Ping Huang, Leslie M. Charns +2 more | 2018-12-25 |
| 9931728 | Polishing pad with foundation layer and polishing surface layer | William C. Allison, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson | 2018-04-03 |
| 9931729 | Polishing pad with grooved foundation layer and polishing surface layer | Paul Andre Lefevre, William C. Allison, James P. LaCasse | 2018-04-03 |
| 9868185 | Polishing pad with foundation layer and window attached thereto | Paul Andre Lefevre, William C. Allison, Jose I. Arno | 2018-01-16 |
| 9649742 | Polishing pad having polishing surface with continuous protrusions | Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Ping Huang, Leslie M. Charns +2 more | 2017-05-16 |
| 9597769 | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer | Paul Andre Lefevre, William C. Allison, James P. LaCasse, Alexander William Simpson, Ping Huang +1 more | 2017-03-21 |
| 9597770 | Method of fabricating a polishing | William C. Allison, Rajeev Bajaj | 2017-03-21 |
| 9597777 | Homogeneous polishing pad for eddy current end-point detection | William C. Allison, Ping Huang, Richard L. Frentzel, Alexander William Simpson | 2017-03-21 |
| 9555518 | Polishing pad with multi-modal distribution of pore diameters | Ping Huang, James P. LaCasse, William C. Allison | 2017-01-31 |
| 9375823 | Grooved CMP pads | Robert Kerprich, Karey Holland, Sudhanshu Misra | 2016-06-28 |
| 9296085 | Polishing pad with homogeneous body having discrete protrusions thereon | Rajeev Bajaj, Ping Huang, Robert Kerprich, William C. Allison, Richard L. Frentzel | 2016-03-29 |
| 9249273 | Polishing pad with alignment feature | Robert Kerprich, William C. Allison | 2016-02-02 |
| 9211628 | Polishing pad with concentric or approximately concentric polygon groove pattern | William C. Allison, Alexander William Simpson | 2015-12-15 |
| 9180570 | Grooved CMP pad | Robert Kerprich, Karey Holland, Sudhanshu Misra | 2015-11-10 |
| 9156124 | Soft polishing pad for polishing a semiconductor substrate | William C. Allison, Robert Kerprich, Ping Huang, Richard L. Frentzel | 2015-10-13 |
| 9067297 | Polishing pad with foundation layer and polishing surface layer | William C. Allison, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson | 2015-06-30 |
| 9067298 | Polishing pad with grooved foundation layer and polishing surface layer | Paul Andre Lefevre, William C. Allison, James P. LaCasse | 2015-06-30 |
| 9028302 | Polishing pad for eddy current end-point detection | William C. Allison, Ping Huang, Richard L. Frentzel, Alexander William Simpson | 2015-05-12 |
| 9017140 | CMP pad with local area transparency | William C. Allison, Ping Huang, Richard L. Frentzel, Robert Kerprich | 2015-04-28 |
| 8968058 | Polishing pad with alignment feature | Robert Kerprich, William C. Allison | 2015-03-03 |
| 8920219 | Polishing pad with alignment aperture | William C. Allison, Rajeev Bajaj | 2014-12-30 |
| 8702479 | Polishing pad with multi-modal distribution of pore diameters | Ping Huang, James P. LaCasse, William C. Allison | 2014-04-22 |