| 9201030 |
Method and system for non-destructive distribution profiling of an element in a film |
Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan |
2015-12-01 |
| 8916823 |
Method and system for non-destructive distribution profiling of an element in a film |
Paolo deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan |
2014-12-23 |
| 8610059 |
Method and system for non-destructive distribution profiling of an element in a film |
Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan |
2013-12-17 |
| 8269167 |
Method and system for non-destructive distribution profiling of an element in a film |
Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan |
2012-09-18 |
| 7884321 |
Method and system for non-destructive distribution profiling of an element in a film |
Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan |
2011-02-08 |
| 6395363 |
Sloped substrate support |
Benjamin Bierman, Robert Haney, David W. LaCourt |
2002-05-28 |
| 6133152 |
Co-rotating edge ring extension for use in a semiconductor processing chamber |
Benjamin Bierman, Meredith J. Williams, Brian Haas, Paul Deaton, James V. Tietz |
2000-10-17 |
| 6123766 |
Method and apparatus for achieving temperature uniformity of a substrate |
Meredith J. Williams, Benjamin Bierman, Paul Deaton, Brian Haas, Nobuyuki Takahashi +1 more |
2000-09-26 |
| 6090210 |
Multi-zone gas flow control in a process chamber |
Benjamin Bierman, James V. Tietz |
2000-07-18 |
| 6035100 |
Reflector cover for a semiconductor processing chamber |
Benjamin Bierman, James V. Tietz, Brian Haas, Meredith J. Williams, Paul Deaton |
2000-03-07 |
| 5960555 |
Method and apparatus for purging the back side of a substrate during chemical vapor processing |
Paul Deaton, Benjamin Bierman, Meredith J. Williams, Brian Haas, James V. Tietz |
1999-10-05 |
| 5920797 |
Method for gaseous substrate support |
Benjamin Bierman, James V. Tietz, Brian Haas |
1999-07-06 |
| 5884412 |
Method and apparatus for purging the back side of a substrate during chemical vapor processing |
James V. Tietz, Benjamin Bierman |
1999-03-23 |
| 5848889 |
Semiconductor wafer support with graded thermal mass |
James V. Tietz, Benjamin Bierman |
1998-12-15 |
| 5820923 |
Curing silica precursors by exposure to nitrous oxide |
Loren A. Haluska, Mark Loboda |
1998-10-13 |
| 5781693 |
Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween |
Benjamin Bierman, James V. Tietz |
1998-07-14 |
| 5523163 |
Low dielectric constant coatings |
Robert Charles Camilletti, Diana K. Dunn |
1996-06-04 |
| 5441765 |
Method of forming Si-O containing coatings |
Robert Charles Camilletti, Diana K. Dunn |
1995-08-15 |
| 5436029 |
Curing silicon hydride containing materials by exposure to nitrous oxide |
Marie N. Eckstein, Mark Loboda, Keith W. Michael, Liberty B. Shelton |
1995-07-25 |
| 5320868 |
Method of forming SI-O containing coatings |
Keith W. Michael |
1994-06-14 |
| 5310583 |
Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide |
Marie N. Eckstein |
1994-05-10 |
| 5145723 |
Process for coating a substrate with silica |
Robert Charles Camilletti, Theresa E. Gentle |
1992-09-08 |
