Issued Patents All Time
Showing 1–25 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431460 | Die processing | — | 2025-09-30 |
| 12424584 | Direct bonding methods and structures | — | 2025-09-23 |
| 12406975 | Techniques for processing devices | Laura Wills Mirkarimi, Guilian Gao, Gaius Gillman Fountain, Jr. | 2025-09-02 |
| 12381119 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2025-08-05 |
| 12381173 | Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Jeremy Alfred Theil | 2025-08-05 |
| 12381117 | Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon | — | 2025-08-05 |
| 12374556 | Processing stacked substrates | Guilian Gao | 2025-07-29 |
| 12341125 | Dimension compensation control for directly bonded structures | Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2025-06-24 |
| 12322667 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2025-06-03 |
| 12322650 | Diffusion barrier for interconnects | Rajesh Katkar | 2025-06-03 |
| 12300661 | Reliable hybrid bonded apparatus | Pawel Mrozek | 2025-05-13 |
| 12272677 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2025-04-08 |
| 12266640 | Molded direct bonded and interconnected stack | Guilian Gao, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2025-04-01 |
| 12266650 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2025-04-01 |
| 12211809 | Structure with conductive feature and method of forming same | — | 2025-01-28 |
| 12205926 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Belgacem Haba, Laura Wills Mirkarimi +1 more | 2025-01-21 |
| 12198981 | Diffusion barrier collar for interconnects | Rajesh Katkar | 2025-01-14 |
| 12199082 | Method of direct-bonded optoelectronic devices | Min Tao, Liang Wang, Rajesh Katkar | 2025-01-14 |
| 12191233 | Embedded cooling systems and methods of manufacturing embedded cooling systems | Belgacem Haba, Thomas Workman, Guilian Gao, Rajesh Katkar | 2025-01-07 |
| 12176263 | Integrated cooling assembly including coolant channel on the backside semiconductor device | Belgacem Haba, Rajesh Katkar | 2024-12-24 |
| 12166024 | Direct-bonded LED arrays drivers | Min Tao, Liang Wang, Rajesh Katkar | 2024-12-10 |
| 12154880 | Method and structures for low temperature device bonding | — | 2024-11-26 |
| 12136605 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed | 2024-11-05 |
| 12132020 | Low temperature bonded structures | Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2024-10-29 |
| 12125784 | Interconnect structures | Gaius Gillman Fountain, Jr., Jeremy Alfred Theil | 2024-10-22 |