Issued Patents All Time
Showing 25 most recent of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813214 | Cavities containing multi-wiring structures and devices | Cyprian Emeka Uzoh, Belgacem Haba, Ilyas Mohammed | 2020-10-20 |
| 10559494 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2020-02-11 |
| 10483217 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Gabriel Z. Guevara, Javier A. Delacruz | 2019-11-19 |
| 10354942 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2019-07-16 |
| 10262947 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2019-04-16 |
| 10037940 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Belgacem Haba | 2018-07-31 |
| 10015881 | Cavities containing multi-wiring structures and devices | Cyprian Emeka Uzoh, Belgacem Haba, Ilyas Mohammed | 2018-07-03 |
| 9972582 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Gabriel Z. Guevara, Javier A. Delacruz | 2018-05-15 |
| 9966303 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2018-05-08 |
| 9859220 | Laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2018-01-02 |
| 9847277 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2017-12-19 |
| 9711401 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Belgacem Haba | 2017-07-18 |
| 9659812 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2017-05-23 |
| 9640437 | Methods of forming semiconductor elements using micro-abrasive particle stream | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2017-05-02 |
| 9634412 | Connector structures and methods | Cyprian Emeka Uzoh | 2017-04-25 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2017-04-11 |
| 9570416 | Stacked packaging improvements | Belgacem Haba, Masud Beroz | 2017-02-14 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2017-01-31 |
| 9385036 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Belgacem Haba | 2016-07-05 |
| 9368476 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-06-14 |
| 9362203 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-06-07 |
| 9355959 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2016-05-31 |
| 9355948 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-05-31 |
| 9355901 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-05-31 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei +1 more | 2016-05-24 |