| 5147741 |
Phenyl-endcapped depolymerizable polymer |
Jon A. Casey, Renuka S. Divakaruni, Steven M. Kandetzke, Catherine A. Lotsko |
1992-09-15 |
| 5049201 |
Method of inhibiting corrosion in an electronic package |
Shirley N. Cheng, Allen J. Arnold, Jeffrey T. Coffin, Luu Thanh Nguyen |
1991-09-17 |
| 4987211 |
Phenyl-endcapped depolymerizable polymer |
Jon A. Casey, Renuka S. Divakaruni, Steven M. Kandetzke, Chatherine A. Lotsko |
1991-01-22 |
| 4871619 |
Electronic components comprising polymide dielectric layers |
Steven M. Kandetzke, Mark A. Takacs |
1989-10-03 |
| 4772346 |
Method of bonding inorganic particulate material |
Herbert R. Anderson, Jr., Renuka S. Divakaruni, Daniel P. Kirby, Robert W. Nufer, Harbans S. Sachdev +3 more |
1988-09-20 |
| 4749621 |
Electronic components comprising polyimide-filled isolation structures |
Steven M. Kandetzke, Mark A. Takacs |
1988-06-07 |
| 4699803 |
Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers |
Steven M. Kandetzke, Mark A. Takacs |
1987-10-13 |
| 4656050 |
Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers |
Steven M. Kandetzke, Mark A. Takacs |
1987-04-07 |
| 4654223 |
Method for forming a film of dielectric material on an electric component |
Steven M. Kandetzke, Mark A. Takacs |
1987-03-31 |
| 4622383 |
Method for the fractionation of reactive terminated polymerizable oligomers |
Steven M. Kandetzke, Mark A. Takacs |
1986-11-11 |
| 4599136 |
Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials |
Steven M. Kandetzke, Ellen L. Kutner, Mark A. Takacs |
1986-07-08 |
| 4568601 |
Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures |
George Czornyj, Steven M. Kandetzke, Mark A. Takacs |
1986-02-04 |
| 4539222 |
Process for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removed |
Herbert R. Anderson, Jr., Catherine A. Lotsko |
1985-09-03 |
| 4504007 |
Solder and braze fluxes and processes for using the same |
Herbert R. Anderson, Jr., Richard A. Bates |
1985-03-12 |
| 4456675 |
Dry process for forming metal patterns wherein metal is deposited on a depolymerizable polymer and selectively removed |
Herbert R. Anderson, Jr., Catherine A. Lotsko |
1984-06-26 |
