Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7611927 | Method of minimizing kerf width on a semiconductor substrate panel | Chih-Chin Liao, Ning Ye, Jack Chang Chien, Hem Takiar | 2009-11-03 |
| 7592699 | Hidden plating traces | Hem Takiar, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2009-09-22 |
| 7550834 | Stacked, interconnected semiconductor packages | Chih-Chin Liao, Hem Takiar | 2009-06-23 |
| 7538438 | Substrate warpage control and continuous electrical enhancement | Ken Jian Ming Wang, Chin-Tien Chiu, Chih-Chin Liao, Han-Shiao Chen | 2009-05-26 |
| 7435624 | Method of reducing mechanical stress on a semiconductor die during fabrication | Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang hua Java Zhu, Jack Chang-Chien | 2008-10-14 |
| 7375415 | Die package with asymmetric leadframe connection | Ming-Hsun Lee, Chih-Chin Liao, Hem Takiar | 2008-05-20 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Hem Takiar | 2008-04-08 |