Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12267961 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2025-04-01 |
| 12062596 | Semiconductor die with stepped side surface | Rongwei Zhang, Bob Lee | 2024-08-13 |
| 11882660 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2024-01-23 |
| 11553596 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2023-01-10 |
| 11421981 | Single wavelength reflection for leadframe brightness measurement | Hung-Yu Chou, Tse-Tsun Chiu, Fu-Kang Lee, Liang-Kang Su | 2022-08-23 |
| 11296030 | Embedded component package structure and manufacturing method thereof | Yu-Ju Liao, Chien-Fan Chen | 2022-04-05 |
| 11277917 | Embedded component package structure, embedded type panel substrate and manufacturing method thereof | Yu-Ju Liao, Chien-Fan Chen, I-Chia Lin | 2022-03-15 |
| 11032911 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2021-06-08 |
| 10950551 | Embedded component package structure and manufacturing method thereof | Yu-Ju Liao, Chien-Fan Chen | 2021-03-16 |
| 10757813 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen | 2020-08-25 |
| 10726956 | Fever epidemic detection system and method thereof | Joe-Air Jiang, Ya-An Chan, Lin-Kuei Su, Cheng-Yue Liu, Po-Han Chen +2 more | 2020-07-28 |
| 10560529 | Vehicle information and environment monitoring compound vehicle system and data processing and transmission method therein | Joe-Air Jiang, Chih-Hong Sun, Tzai-Hung Wen, Jehn-Yih Juang, Zheng Ye +1 more | 2020-02-11 |
| 10429174 | Single wavelength reflection for leadframe brightness measurement | Hung-Yu Chou, Tse-Tsun Chiu, Fu-Kang Lee, Liang-Kang Su | 2019-10-01 |
| 10139444 | Sensing circuit, sensing device and monitoring system for power transmission lines | Joe-Air Jiang, Xiang ZHENG, Yu-Cheng Yang, Ching-Ya Tseng | 2018-11-27 |
| 9680935 | Grid gateway and transmission tower management system with multiple grid gateways | Joe-Air Jiang, Cheng-Long Chuang, Chia-Pang Chen, Chih-Hao Syue, Xiang ZHENG | 2017-06-13 |
| 8895368 | Method for manufacturing chip package structure | — | 2014-11-25 |
| 8671562 | Method for manufacturing a circuit board | — | 2014-03-18 |
| 8510940 | Method of fabricating a multi-trace via substrate | Min-Yao CHEN, Mao-Chang Chuang, Ming-Chiang Lee | 2013-08-20 |
| 8416577 | Coreless substrate and method for making the same | Ming-Chiang Lee | 2013-04-09 |
| 8387239 | Manufacturing method of embedded circuit substrate | Ming-Chiang Lee | 2013-03-05 |
| 8372689 | Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof | Ming-Chiang Lee | 2013-02-12 |
| 8320134 | Embedded component substrate and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Ming-Chiang Lee | 2012-11-27 |
| 8273601 | Method of fabricating multi-chip package structure | — | 2012-09-25 |
| 8178156 | Surface treatment process for circuit board | — | 2012-05-15 |
| 8132320 | Circuit board process | — | 2012-03-13 |