| 8956920 |
Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe |
Tsung-Yi Wu, Tsung-Wen Chang |
2015-02-17 |
| D640668 |
High definition television speaker |
— |
2011-06-28 |
| D570847 |
Media device docking station with a speaker |
— |
2008-06-10 |
| 6500742 |
Construction of a film on a semiconductor wafer |
Michal Danek, Marvin Liao, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more |
2002-12-31 |
| 6444036 |
Construction of a film on a semiconductor wafer |
Michal Danek, Marvin Liao, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more |
2002-09-03 |
| 6291343 |
Plasma annealing of substrates to improve adhesion |
Jennifer Meng Chu Tseng, Mei Chang, Ling Chen, David Charles Smith, Karl A. Littau +1 more |
2001-09-18 |
| 6251758 |
Construction of a film on a semiconductor wafer |
Michal Danek, Marvin Liao, Roderick C. Mosely, Karl A. Littau, Ivo Raaijmakers +1 more |
2001-06-26 |
| 5834068 |
Wafer surface temperature control for deposition of thin films |
Wei-Min Chen, Marvin Liao, Jennifer Meng Chu Tseng, Mei Chang |
1998-11-10 |
