CB

Chintan Buch

Applied Materials: 13 patents #1,030 of 7,310Top 15%
AM AMD: 1 patents #5,683 of 9,279Top 65%
Overall (All Time): #309,466 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12374611 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more 2025-07-29
12087679 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more 2024-09-10
12080632 Glass core package substrates Deepak Kulkarni, Rahul Agarwal, Rajasekaran Swaminathan 2024-09-03
11931855 Planarization methods for packaging substrates Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia +3 more 2024-03-19
11927885 Fluoropolymer stamp fabrication method Roman Gouk, Jean Delmas, Steven Verhaverbeke 2024-03-12
11881447 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more 2024-01-23
11862546 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more 2024-01-02
11798903 Methods of forming microvias with reduced diameter Roman Gouk, Steven Verhaverbeke 2023-10-24
11521937 Package structures with built-in EMI shielding Steven Verhaverbeke, Han-Wen Chen, Giback Park 2022-12-06
11454884 Fluoropolymer stamp fabrication method Roman Gouk, Jean Delmas, Steven Verhaverbeke 2022-09-27
11388822 Methods for improved polymer-copper adhesion Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Prerna Goradia, Giback Park +1 more 2022-07-12
11315890 Methods of forming microvias with reduced diameter Roman Gouk, Steven Verhaverbeke 2022-04-26
11281094 Method for via formation by micro-imprinting Roman Gouk, Giback Park, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke +1 more 2022-03-22
10937726 Package structure with embedded core Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more 2021-03-02
10727083 Method for via formation in flowable epoxy materials by micro-imprint Roman Gouk, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke, Vincent DiCaprio 2020-07-28