| 8558368 |
Bi-directional, reverse blocking battery switch |
James Harnden, Anthony Chia, Liming Wong, Hongbo Yang, Hui Teng +1 more |
2013-10-15 |
| 8358017 |
Semiconductor package featuring flip-chip die sandwiched between metal layers |
— |
2013-01-22 |
| 8120154 |
Interconnection of lead frame to die utilizing flip chip process |
Mohammad Eslamy |
2012-02-21 |
| 8106493 |
Semiconductor device package having features formed by stamping |
Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu |
2012-01-31 |
| 8097945 |
Bi-directional, reverse blocking battery switch |
James Harnden, Anthony Chia, Liming Wong, Hongbo Yang, Hui Teng +1 more |
2012-01-17 |
| 7838339 |
Semiconductor device package having features formed by stamping |
Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu |
2010-11-23 |
| 7691670 |
Interconnection of lead frame to die utilizing flip chip process |
Mohammad Eslamy |
2010-04-06 |
| 6277695 |
Method of forming vertical planar DMOSFET with self-aligned contact |
Richard K. Williams, Sung-Shan Tai, Dorman C. Pitzer, Wayne B. Grabowski, Mike F. Chang |
2001-08-21 |
| 6249041 |
IC chip package with directly connected leads |
Y. Mohammed Kasem, Lixiong Luo, Yueh-Se Ho |
2001-06-19 |
| 6066890 |
Separate circuit devices in an intra-package configuration and assembly techniques |
Y. Mohammed Kasem |
2000-05-23 |