Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908784 | Packaged semiconductor device assembly | Andrew Jefferson Mawer, Nishant Lakhera, Chee Seng Foong, Nihaar N. Mahatme | 2024-02-20 |
| 11270972 | Package with conductive underfill ground plane | Nishant Lakhera, Chee Seng Foong | 2022-03-08 |
| 11189557 | Hybrid package | Nishant Lakhera, Chee Seng Foong | 2021-11-30 |
| 10431534 | Package with support structure | Nishant Lakhera, Gilles Montoriol, Trung Q. Duong, Navas Khan Oratti Kalandar | 2019-10-01 |
| 10217698 | Die attachment for packaged semiconductor device | Rama I. Hegde, Nishant Lakhera | 2019-02-26 |
| 10211184 | Apparatus and methods for multi-die packaging | Nishant Lakhera, Navas Khan Oratti Kalandar | 2019-02-19 |
| 10147645 | Wafer level chip scale package with encapsulant | Navas Khan Oratti Kalandar, Nishant Lakhera | 2018-12-04 |
| 9978614 | Structure and method to minimize warpage of packaged semiconductor devices | Nishant Lakhera, James R. Guajardo, Varughese Mathew | 2018-05-22 |
| 9953904 | Electronic component package with heatsink and multiple electronic components | Navas Khan Oratti Kalandar, Nishant Lakhera | 2018-04-24 |
| 9947614 | Packaged semiconductor device having bent leads and method for forming | Navas Khan Oratti Kalandar, Nishant Lakhera, Boon Yew Low | 2018-04-17 |
| 9691637 | Method for packaging an integrated circuit device with stress buffer | Navas Khan Oratti Kalandar, Nishant Lakhera | 2017-06-27 |
| 9598280 | Environmental sensor structure | Dwight L. Daniels, Darrel R. Frear, Stephen R. Hooper | 2017-03-21 |
| 9559077 | Die attachment for packaged semiconductor device | Rama I. Hegde, Nishant Lakhera | 2017-01-31 |
| 9508632 | Apparatus and methods for stackable packaging | Navas Khan Oratti Kalandar, Nishant Lakhera, Varughese Mathew | 2016-11-29 |