Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11187992 | Predictive modeling of metrology in semiconductor processes | Raman K. Nurani, Koushik Ragavan | 2021-11-30 |
| 11088039 | Data management and mining to correlate wafer alignment, design, defect, process, tool, and metrology data | Raman K. Nurani, Koushik Ragavan, Karanpreet Aujla | 2021-08-10 |
| 10614262 | Method of predicting areas of vulnerable yield in a semiconductor substrate | Raman K. Nurani, Koushik Ragavan, Karanpreet Aujla | 2020-04-07 |
| 10579041 | Semiconductor process control method | Raman K. Nurani, Koushik Ragavan | 2020-03-03 |
| 10579769 | Using design proximity index and effect-to-design proximity ratio to control semiconductor processes and achieve enhanced yield | Raman K. Nurani, Koushik Ragavan | 2020-03-03 |
| 10481199 | Data analytics and computational analytics for semiconductor process control | Raman K. Nurani, Koushik Ragavan | 2019-11-19 |
| 8831767 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2014-09-09 |
| 8010222 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2011-08-30 |
| 7332438 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2008-02-19 |
| 7175503 | Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2007-02-13 |
| 7052369 | Methods and systems for detecting a presence of blobs on a specimen during a polishing process | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2006-05-30 |
| 7030018 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2006-04-18 |
| 6935922 | Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2005-08-30 |
| 6884146 | Systems and methods for characterizing a polishing process | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2005-04-26 |
| 6866559 | Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad | Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Christopher F. Bevis +3 more | 2005-03-15 |
| 6849946 | Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect | Christopher A. Seams | 2005-02-01 |
| 6671051 | Apparatus and methods for detecting killer particles during chemical mechanical polishing | Mehrdad Nikoonahad, Guoheng Zhao | 2003-12-30 |
| 6566249 | Planarized semiconductor interconnect topography and method for polishing a metal layer to form wide interconnect structures | William W. C. Koutny, Jr., Christopher A. Seams | 2003-05-20 |
| 6361415 | Employing an acidic liquid and an abrasive surface to polish a semiconductor topography | William W. C. Koutny, Jr. | 2002-03-26 |
| 6302766 | System for cleaning a surface of a dielectric material | William W. C. Koutny, Jr. | 2001-10-16 |
| 6232231 | Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect | Christopher A. Seams | 2001-05-15 |
| 6218305 | Composition and method for polishing a composite of silica and silicon nitride | Sharath Hosali, Jiun-Fang Wang, Lee Melbourne Cook, Michael R. Oliver | 2001-04-17 |
| 6200896 | Employing an acidic liquid and an abrasive surface to polish a semiconductor topography | William Koutny | 2001-03-13 |
| 6132637 | Composition and method for polishing a composite of silica and silicon nitride | Sharath Hosali, Jiun-Fang Wang, Lee Melbourne Cook, Michael R. Oliver | 2000-10-17 |
| 6042741 | Composition for polishing a composite of silica and silicon nitride | Sharath Hosali, Jiun-Fang Wang, Lee Melbourne Cook | 2000-03-28 |