Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381326 | Structure and method for integrated circuits packaging with increased density | Charles G. Woychik, Andrew Cao, Bong-Sub Lee | 2019-08-13 |
| 10283484 | Low cost substrates | Cyprian Emeka Uzoh | 2019-05-07 |
| 10256177 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Guilian Gao | 2019-04-09 |
| 10204893 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2019-02-12 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Guilian Gao | 2019-01-08 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-01-08 |
| 10032751 | Ultrathin layer for forming a capacitive interface between joined integrated circuit components | Belgacem Haba | 2018-07-24 |
| 10002844 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2018-06-19 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9905507 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Zhuowen Sun, Charles G. Woychik | 2018-02-27 |
| 9905523 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Hong Shen, Liang Wang | 2018-02-27 |
| 9899281 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Charles G. Woychik | 2018-02-20 |
| 9887166 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Laura Wills Mirkarimi, Charles G. Woychik | 2018-02-06 |
| 9865548 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Scott McGrath, Hong Shen +2 more | 2018-01-02 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Liang Wang +2 more | 2017-11-21 |
| 9769923 | Interposers | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi | 2017-09-19 |
| 9741620 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Hong Shen | 2017-08-22 |
| 9741696 | Thermal vias disposed in a substrate proximate to a well thereof | Rajesh Katkar, Cyprian Emeka Uzoh | 2017-08-22 |
| 9741649 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Guilian Gao | 2017-08-22 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2017-06-27 |
| 9685420 | Localized sealing of interconnect structures in small gaps | Rajesh Katkar, Cyprian Emeka Uzoh | 2017-06-20 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi | 2017-02-14 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Liang Wang +2 more | 2017-01-17 |
| 9536862 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Hong Shen, Charles G. Woychik | 2017-01-03 |