PS

Pekka Soininen

IV Interuniversitair Micro-Electronica Centrum Vzw: 2 patents #79 of 450Top 20%
PO Picosun Oy: 2 patents #13 of 32Top 45%
Nokia: 2 patents #683 of 1,537Top 45%
AA Asm America: 1 patents #116 of 181Top 65%
AB Asm Ip Holding B.V.: 1 patents #418 of 620Top 70%
📍 Helsinki, FI: #18 of 3,940 inventorsTop 1%
Overall (All Time): #45,706 of 4,157,543Top 2%
55
Patents All Time

Issued Patents All Time

Showing 26–50 of 55 patents

Patent #TitleCo-InventorsDate
7537662 Method and apparatus for depositing thin films on a surface Sven Lindfors 2009-05-26
7494927 Method of growing electrical conductors Juhana Kostamo, Kai-Erik Elers, Suvi Haukka 2009-02-24
7485340 Production of elemental films using a boron-containing reducing agent Kai-Erik Elers, Ville Antero Saanila, Sari Johanna Kaipio 2009-02-03
7465658 Oxygen bridge structures and methods to form oxygen bridge structures Ivo Raaijmakers, Kai-Erik Elers 2008-12-16
7329590 Method for depositing nanolaminate thin films on sensitive surfaces Kai-Erik Elers, Suvi Haukka, Ville Antero Saanila, Sari Johanna Kaipio 2008-02-12
7323422 Dielectric layers and methods of forming the same Ivo Raaijmakers, Jan Willem Maes 2008-01-29
7241677 Process for producing integrated circuits including reduction using gaseous organic compounds Kai-Erik Elers 2007-07-10
7144809 Production of elemental films using a boron-containing reducing agent Kai-Erik Elers, Ville Antero Saanila, Sari Johanna Kaipio 2006-12-05
7102235 Conformal lining layers for damascene metallization Ivo Raaijmakers, Suvi Haukka, Yille A. Saanila, Kai-Erik Elers, Ernst H. A. Granneman 2006-09-05
7034397 Oxygen bridge structures and methods to form oxygen bridge structures Ivo Raaijmakers, Kai-Erik Elers 2006-04-25
6936535 Copper interconnect structure having stuffed diffusion barrier Ki Bum Kim, Ivo Raaijmakers 2005-08-30
6921712 Process for producing integrated circuits including reduction using gaseous organic compounds Kai-Erik Elers 2005-07-26
6902763 Method for depositing nanolaminate thin films on sensitive surfaces Kai-Erik Elers, Suvi Haukka, Ville Antero Saanila, Sari Johanna Kaipio 2005-06-07
6887795 Method of growing electrical conductors Kai-Erik Elers, Suvi Haukka 2005-05-03
6878628 In situ reduction of copper oxide prior to silicon carbide deposition Auguste Sophie, Hessel Sprey, Kai-Erik Elers 2005-04-12
6863727 Method of depositing transition metal nitride thin films Kai-Erik Elers, Suvi Haukka, Ville Antero Saanila, Sari Johanna Kaipio 2005-03-08
6852635 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes Alessandra Satta, Karen Maex, Kai-Erik Elers, Ville Antero Saanila, Suvi Haukka 2005-02-08
6821889 Production of elemental thin films using a boron-containing reducing agent Kai-Erik Elers, Ville Antero Saanila, Sari Johanna Kaipio 2004-11-23
6800552 Deposition of transition metal carbides Kai-Erik Elers, Suvi Haukka, Ville Antero Saanila, Sari Johanna Kaipio 2004-10-05
6794287 Process for growing metal or metal carbide thin films utilizing boron-containing reducing agents Ville Antero Saanila, Kai-Erik Elers, Sari Johanna Kaipio 2004-09-21
6727169 Method of making conformal lining layers for damascene metallization Ivo Raaijmakers, Suvi Haukka, Ville Antero Saanila, Kai-Erik Elers, Ernst H. A. Granneman 2004-04-27
6679951 Metal anneal with oxidation prevention Kai-Erik Elers, Ernst H. A. Granneman 2004-01-20
6664192 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes Alessandra Satta, Karen Maex, Kai-Erik Elers, Ville Antero Saanila, Suvi Haukka 2003-12-16
6599572 Process for growing metalloid thin films utilizing boron-containing reducing agents Ville Antero Saanila, Kai-Erik Elers, Sari Johanna Kaipio 2003-07-29
6482262 Deposition of transition metal carbides Kai-Erik Elers, Suvi Haukka, Ville Antero Saanila, Sari Johanna Kaipio 2002-11-19