Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121726 | Cooler for semiconductor devices | Sven Albers, Andreas Wolter, Georg Seidemann, Christian Geissler, Alexandra Atzesdorfer +1 more | 2018-11-06 |
| 10115668 | Semiconductor package having a variable redistribution layer thickness | Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2018-10-30 |
| 9921694 | Wearable computing device | Sven Albers, Teodora Ossiander, Andreas Wolter, Sonja Koller, Georg Seidemann +3 more | 2018-03-20 |
| 9865387 | Electronic package with coil formed on core | Sven Albers, Andreas Wolter | 2018-01-09 |
| 9741651 | Redistribution layer lines | Sven Albers, Christian Geissler | 2017-08-22 |
| 9711492 | Three dimensional structures within mold compound | Sven Albers, Andreas Wolter, Thorsten Meyer | 2017-07-18 |
| 9646856 | Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip | Thorsten Meyer, David O'Sullivan | 2017-05-09 |
| 9064883 | Chip with encapsulated sides and exposed surface | Thorsten Meyer, David O'Sullivan | 2015-06-23 |