Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11700002 | Network-on-chip (NOC) with flexible data width | Sharath Raghava, Dheeraj Subbareddy, Harsha Gupta, James Ball, Kavitha Prasad +1 more | 2023-07-11 |
| 11669472 | Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Dheeraj Subbareddy, Chee Hak Teh, MD Altaf Hossain | 2023-06-06 |
| 11658144 | Innovative interconnect design for package architecture to improve latency | MD Altaf Hossain, Dheeraj Subbareddy | 2023-05-23 |
| 11621713 | High-speed core interconnect for multi-die programmable logic devices | Lai Guan Tang, Dheeraj Subbareddy | 2023-04-04 |
| 11609262 | On-die aging measurements for dynamic timing modeling | Dheeraj Subbareddy, Mahesh A. Iyer, Dhananjay Raghavan | 2023-03-21 |
| 11610856 | Connectivity between integrated circuit dice in a multi-chip package | Robert Sankman, Dheeraj Subbareddy, MD Altaf Hossain | 2023-03-21 |
| 11595045 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2023-02-28 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik +7 more | 2023-01-17 |
| 11538753 | Electronic chip with under-side power block | MD Altaf Hossain, Scott Gilbert, Jin Zhao | 2022-12-27 |
| 11528029 | Apparatus to synchronize clocks of configurable integrated circuit dies through an interconnect bridge | Lai Guan Tang, Dheeraj Subbareddy | 2022-12-13 |
| 11500412 | Techniques for clock signal transmission in integrated circuits and interposers | Jeffrey Christopher Chromczak, Chooi Pei Lim, Lai Guan Tang, Chee Hak Teh, MD Altaf Hossain +1 more | 2022-11-15 |
| 11368158 | Methods for handling integrated circuit dies with defects | Dheeraj Subbareddy, Mahesh A. Iyer | 2022-06-21 |
| 11342918 | Network-on-chip (NOC) with flexible data width | Sharath Raghava, Dheeraj Subbareddy, Harsha Gupta, James Ball, Kavitha Prasad +1 more | 2022-05-24 |
| 11342238 | Rotatable architecture for multi-chip package (MCP) | MD Altaf Hossain, Dheeraj Subbareddy | 2022-05-24 |
| 11216397 | Translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Dheeraj Subbareddy, Chee Hak Teh, MD Altaf Hossain | 2022-01-04 |
| 11128301 | High-speed core interconnect for multi-die programmable logic devices | Lai Guan Tang, Dheeraj Subbareddy | 2021-09-21 |
| 11121109 | Innovative interconnect design for package architecture to improve latency | MD Altaf Hossain, Dheeraj Subbareddy | 2021-09-14 |
| 11080449 | Modular periphery tile for integrated circuit device | Chee Hak Teh, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2021-08-03 |
| 11070209 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2021-07-20 |
| 11056452 | Interface bus for inter-die communication in a multi-chip package over high density interconnects | Dheeraj Subbareddy, MD Altaf Hossain | 2021-07-06 |
| 10790827 | Network-on-chip (NOC) with flexible data width | Sharath Raghava, Dheeraj Subbareddy, Harsha Gupta, James Ball, Kavitha Prasad +1 more | 2020-09-29 |
| 10666261 | High-speed core interconnect for multi-die programmable logic devices | Lai Guan Tang, Dheeraj Subbareddy | 2020-05-26 |
| 10649927 | Dual in-line memory module (DIMM) programmable accelerator card | Sharath Raghava, Dheeraj Subbareddy, Kavitha Prasad, Harsha Gupta | 2020-05-12 |
| 10642946 | Modular periphery tile for integrated circuit device | Chee Hak Teh, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2020-05-05 |
| 10601426 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2020-03-24 |