Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12425030 | Systems and methods for configurable interface circuits | Paul Rotker, Luis Hau, Ilya K. Ganusov | 2025-09-23 |
| 12394713 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Han Wooi Lim, Hee Kong Phoon | 2025-08-19 |
| 12334449 | Selective use of different advanced interface bus with electronic chips | Dheeraj Subbareddy, Ankireddy Nalamalpu, Mahesh Kumashikar | 2025-06-17 |
| 12153866 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt | 2024-11-26 |
| 12026008 | Techniques for clock signal transmission in integrated circuits and interposers | Jeffrey Christopher Chromczak, Chooi Pei Lim, Chee Hak Teh, MD Altaf Hossain, Dheeraj Subbareddy +1 more | 2024-07-02 |
| 12009298 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Han Wooi Lim, Hee Kong Phoon | 2024-06-11 |
| 11726932 | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices | George Chong Hean Ooi, Chee Hak Teh | 2023-08-15 |
| 11714941 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt | 2023-08-01 |
| 11669472 | Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package | Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh, MD Altaf Hossain | 2023-06-06 |
| 11670589 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Han Wooi Lim, Hee Kong Phoon | 2023-06-06 |
| 11621713 | High-speed core interconnect for multi-die programmable logic devices | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2023-04-04 |
| 11528029 | Apparatus to synchronize clocks of configurable integrated circuit dies through an interconnect bridge | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2022-12-13 |
| 11500412 | Techniques for clock signal transmission in integrated circuits and interposers | Jeffrey Christopher Chromczak, Chooi Pei Lim, Chee Hak Teh, MD Altaf Hossain, Dheeraj Subbareddy +1 more | 2022-11-15 |
| 11336286 | Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies | Hup Chin Teh, Kiun Kiet Jong | 2022-05-17 |
| 11216397 | Translation circuitry for an interconnection in an active interposer of a semiconductor package | Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh, MD Altaf Hossain | 2022-01-04 |
| 11128301 | High-speed core interconnect for multi-die programmable logic devices | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2021-09-21 |
| 11080449 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt | 2021-08-03 |
| 11062070 | Die to die interconnect structure for modularized integrated circuit devices | Chee Hak Teh | 2021-07-13 |
| 11036660 | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices | George Chong Hean Ooi, Chee Hak Teh | 2021-06-15 |
| 10886218 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Han Wooi Lim, Hee Kong Phoon | 2021-01-05 |
| 10666261 | High-speed core interconnect for multi-die programmable logic devices | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2020-05-26 |
| 10642946 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt | 2020-05-05 |
| 10382013 | Pulse-width modulation voltage identification interface | Kris P. Dehnel, Benoit Herve | 2019-08-13 |
| 10211833 | Techniques for power control of circuit blocks | — | 2019-02-19 |
| 10177753 | Techniques for generating pulse-width modulation data | Kang Ting | 2019-01-08 |