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— |
2025-06-10 |
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Fabric die to fabric die interconnect for modularized integrated circuit devices |
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| 11670589 |
Fabric die to fabric die interconnect for modularized integrated circuit devices |
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Variable delay circuits and methods |
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2021-06-22 |
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Flexible transmitter circuitry for integrated circuits |
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2020-11-24 |
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Low power clamp for electrical overstress protection |
Amit Kumar Srivastava |
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High resolution and low power interpolator for delay chain |
Tat Hin Tan |
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Phase-locked loops with electrical overstress protection circuitry |
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2018-04-10 |
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Chia How Low, Yick Yaw Ho |
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Method of moulding |
Sze Lam Chua |
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Portable electronics apparatus housing and chassis |
Huen S. Chan, Dah C. Lim |
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Converter console |
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1990-09-04 |
