Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabric die to fabric die interconnect for modularized integrated circuit devices

Fabric die to fabric die interconnect for modularized integrated circuit devices

US Patent 12394713 · Granted Aug 19, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Offset calibration method and apparatus for high bandwidth memory 3 (HBM3)2025
System and a method for aligning a programmable clock or strobe2025
Systems and methods for configurable interface circuits2025
System and a method for network-on-chip power management2025
Network-on-chip system for optimizing data transfer2025
Selective use of different advanced interface bus with electronic chips2025
Device, method and system to determine calibration information with a shared rin2025
Memory controller for improving data integrity and providing data security and a2025
Method and a system for network-on-chip arbitration2025
Micro-network-on-chip and microsector infrastructure2024
Modular periphery tile for integrated circuit device2024
Modular periphery tile for integrated circuit device2024