Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7589403 | Lead structure for a semiconductor component and method for producing the same | Michael Bauer, Angela Kessler, Wolfgang Schober, Joachim Mahler | 2009-09-15 |
| 7504711 | Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof | Gottfried Beer, Jochen Dangelmaier, Manfred Mengel, Klaus Mueller, Klaus Pressel | 2009-03-17 |
| 7464603 | Sensor component with a cavity housing and a sensor chip and method for producing the same | Michael Bauer, Angela Kessler, Wolfgang Schober, Joachim Mahler | 2008-12-16 |
| 7462940 | Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same | Michael Bauer, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2008-12-09 |
| 7443019 | Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same | Michael Bauer, Angela Kessler, Joachim Mahler, Wolfgang Schober | 2008-10-28 |
| 7312533 | Electronic component with flexible contacting pads and method for producing the electronic component | Harry Hedler, Jens Pohl | 2007-12-25 |
| 7268423 | Flexible rewiring plate for semiconductor components, and process for producing it | Gottfried Beer, Jochen Dangelmaier, Manfred Mengel, Klaus Mueller, Klaus Pressel | 2007-09-11 |
| 7230309 | Semiconductor component and sensor component for data transmission devices | Michael Bauer, Thomas Engling, Joachim Mahler, Wolfgang Schober | 2007-06-12 |
| 6956287 | Electronic component with flexible bonding pads and method of producing such a component | Harry Hedler | 2005-10-18 |
| 6949820 | Substrate-based chip package | Martin Reiss, Steffen Kroehnert | 2005-09-27 |
| 6914328 | Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers | — | 2005-07-05 |
| 6897568 | Electronic component with flexible contacting pads and method for producing the electronic component | Harry Hedler, Jens Pohl | 2005-05-24 |