Issued Patents All Time
Showing 201–225 of 347 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136402 | High efficiency flexible solar cells for consumer electronics | Bahman Hekmatshoartabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-09-15 |
| 9130105 | Thin light emitting diode and fabrication method | Bahman Hekmatshoartabari, Devendra K. Sadana, Davood Shahrjerdi | 2015-09-08 |
| 9105518 | Method of large-area circuit layout recognition | Bahman Hekmatshoar-Tabari, Ali Khakifirooz, John A. Ott, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-08-11 |
| 9099596 | Heterojunction photovoltaic device and fabrication method | Keith E. Fogel, Bahman Hekmatshoar-Tabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-08-04 |
| 9096050 | Wafer scale epitaxial graphene transfer | Christos D. Dimitrakopoulos, Keith E. Fogel, James B. Hannon, Jeehwan Kim, Hongsik Park +2 more | 2015-08-04 |
| 9079269 | Spalling with laser-defined spall edge regions | Cheng-Wei Cheng, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger, Norma E. Sosa Cortes +2 more | 2015-07-14 |
| 9064722 | Breakdown voltage multiplying integration scheme | Bahman Hekmatshoartabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-06-23 |
| 9064743 | Flexible, stretchable electronic devices | Wilfried E. Haensch, Bahman Hekmatshoartabari, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-06-23 |
| 9058990 | Controlled spalling of group III nitrides containing an embedded spall releasing plane | Can Bayram, Keith E. Fogel, John A. Ott, Devendra K. Sadana | 2015-06-16 |
| 9059073 | Method for controlled removal of a semiconductor device layer from a base substrate | Cheng-Wei Cheng, Devendra K. Sadana, Kuen-Ting Shiu, Norma E. Sosa Cortes | 2015-06-16 |
| 9048365 | Tunable light-emitting diode | Bahman Hekmatshoartabari, Devendra K. Sadana, Davood Shahrjerdi | 2015-06-02 |
| 9040432 | Method for facilitating crack initiation during controlled substrate spalling | Keith E. Fogel, Bahman Hekmatshoartabari, Paul A. Lauro, Devendra K. Sadana, Davood Shahrjerdi | 2015-05-26 |
| 9041167 | Radiation hardened SOI structure and method of making same | Bahman Hekmatshoartabari, Ali Khakifirooz, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-05-26 |
| 9040392 | Method for controlled removal of a semiconductor device layer from a base substrate | Cheng-Wei Cheng, Devendra K. Sadana, Kuen-Ting Shiu, Norma E. Sosa Cortes | 2015-05-26 |
| 9018675 | Heterojunction III-V photovoltaic cell fabrication | Norma E. Sosa Cortes, Keith E. Fogel, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-04-28 |
| 8981449 | Extremely thin semiconductor on insulator (ETSOI) logic and memory hybrid chip | Bahman Hekmatshoar-Tabari, Ali Khakifirooz, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-03-17 |
| 8969992 | Autonomous integrated circuits | Norma E. Sosa Cortes, Wilfried E. Haensch, Steven J. Koester, Devendra K. Sadana, Katherine L. Saenger +2 more | 2015-03-03 |
| 8969174 | Fixed curvature force loading of mechanically spalled films | Keith E. Fogel, Paul A. Lauro, Xiao Hu Liu, Devendra K. Sadana | 2015-03-03 |
| 8969109 | Tunable light-emitting diode | Bahman Hekmatshoartabari, Devendra K. Sadana, Davood Shahrjerdi | 2015-03-03 |
| 8946054 | Crack control for substrate separation | Cheng-Wei Cheng, Devendra K. Sadana, Katherine L. Saenger, Kuen-Ting Shiu | 2015-02-03 |
| 8940569 | Dual-gate bio/chem sensor | Bahman Hekmatshoartabari, Ghavam G. Shahidi, Davood Shahrjerdi | 2015-01-27 |
| 8936961 | Removal of stressor layer from a spalled layer and method of making a bifacial solar cell using the same | Keith E. Fogel, Bahman Hekmatshoartabari, Paul A. Lauro, Ning Li, Devendra K. Sadana +2 more | 2015-01-20 |
| 8933515 | Device structure, layout and fabrication method for uniaxially strained transistors | Huiming Bu, Kangguo Cheng, Bruce B. Doris, Johnathan E. Faltermeier, Ali Khakifirooz +2 more | 2015-01-13 |
| 8933456 | Germanium-containing release layer for transfer of a silicon layer to a substrate | Keith E. Fogel, Daniel A. Inns, Jeehwan Kim, Devendra K. Sadana, Katherine L. Saenger | 2015-01-13 |
| 8927431 | High-rate chemical vapor etch of silicon substrates | Gen P. Lauer, Isaac Lauer, Joseph S. Newbury | 2015-01-06 |