Issued Patents All Time
Showing 201–225 of 263 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7366632 | Method and apparatus for three-dimensional measurements | Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey, Martin P. O'Boyle | 2008-04-29 |
| 7362574 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-04-22 |
| 7349213 | Coolant control unit, and cooled electronics system and method employing the same | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-03-25 |
| 7349209 | Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-03-25 |
| 7301770 | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons +1 more | 2007-11-27 |
| 7298618 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-11-20 |
| 7298617 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-11-20 |
| 7286351 | Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-10-23 |
| 7283358 | Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region | Levi A. Campbell, Ricahrd C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-10-16 |
| 7277283 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-10-02 |
| 7274566 | Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-09-25 |
| 7272005 | Multi-element heat exchange assemblies and methods of fabrication for a cooling system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-09-18 |
| 7270174 | Method, system and program product for automatically checking coolant loops of a cooling system for a computing environment | Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Randy J. Zoodsma | 2007-09-18 |
| 7233494 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-06-19 |
| 7228888 | Rotatable liquid reservoir for computer cooling | Eric A. Eckberg, James D. Gerken, Cary M. Huettner | 2007-06-12 |
| 7206203 | Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-04-17 |
| 7190580 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages | Raschid J. Bezama, Evan G. Colgan, John Harold Magerlein | 2007-03-13 |
| 7184269 | Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2007-02-27 |
| 7139172 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages | Raschid J. Bezama, Evan G. Colgan, John Harold Magerlein | 2006-11-21 |
| 7133286 | Method and apparatus for sealing a liquid cooled electronic device | Prabjit Singh | 2006-11-07 |
| 7119433 | Packaging for enhanced thermal and structural performance of electronic chip modules | John Saunders Corbin, Jr., Gary F. Goth, Dales Morrison Kent, William P. Kostenko, John G. Torok | 2006-10-10 |
| 7104081 | Condensate removal system and method for facilitating cooling of an electronics system | Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2006-09-12 |
| 7106590 | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems | Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Randy J. Zoodsma | 2006-09-12 |
| 7086247 | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2006-08-08 |
| 7088585 | Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems | Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Takeshi Tsukamoto | 2006-08-08 |