Issued Patents All Time
Showing 176–200 of 263 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7651260 | Apparatus for thermal characterization under non-uniform heat load | Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey | 2010-01-26 |
| 7641101 | Method of assembling a cooling system for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2010-01-05 |
| 7639499 | Liquid cooling apparatus and method for facilitating cooling of an electronics system | Levi A. Campbell, Richard C. Chu, Martin Joseph Crippen, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +3 more | 2009-12-29 |
| 7639498 | Conductive heat transport cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink +1 more | 2009-12-29 |
| 7630795 | Method and air-cooling unit with dynamic airflow and heat removal adjustability | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-12-08 |
| 7609519 | Coolant control unit and cooled electronics system employing the same | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-10-27 |
| 7593227 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Donald W. Porter +1 more | 2009-09-22 |
| 7518871 | Liquid-based cooling system for cooling a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-04-14 |
| 7511957 | Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-03-31 |
| 7492593 | Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-02-17 |
| 7486514 | Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-02-03 |
| 7486512 | Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-02-03 |
| 7477514 | Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2009-01-13 |
| 7450385 | Liquid-based cooling apparatus for an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-11-11 |
| 7440281 | Thermal interface apparatus | Sean Bailey, Richard Lidio Blanco, Jr., David L. Edwards, Supratik Guha, Michael D. Hillman +6 more | 2008-10-21 |
| 7420808 | Liquid-based cooling system for cooling a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-09-02 |
| 7408776 | Conductive heat transport cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink +1 more | 2008-08-05 |
| 7405936 | Hybrid cooling system for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-07-29 |
| 7400505 | Hybrid cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-07-15 |
| 7400504 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-07-15 |
| 7397661 | Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-07-08 |
| 7385810 | Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack | Richard C. Chu, Michael J. Ellsworth, Jr., Donald W. Porter, Robert E. Simons | 2008-06-10 |
| 7385817 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-06-10 |
| 7380409 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Donald W. Porter +1 more | 2008-06-03 |
| 7375962 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons | 2008-05-20 |