RS

Roger R. Schmidt

IBM: 252 patents #106 of 70,183Top 1%
LP Lenovo (Singapore) Pte.: 7 patents #83 of 1,012Top 9%
Apple: 1 patents #12,251 of 18,612Top 70%
📍 Poughkeepsie, NY: #6 of 1,613 inventorsTop 1%
🗺 New York: #82 of 115,490 inventorsTop 1%
Overall (All Time): #1,755 of 4,157,543Top 1%
263
Patents All Time

Issued Patents All Time

Showing 226–250 of 263 patents

Patent #TitleCo-InventorsDate
7011143 Method and apparatus for cooling electronic components Joseph P. Corrado, John F. Eberth, Steven J. Mazzuca, Takeshi Tsukamoto 2006-03-14
7012807 Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons 2006-03-14
7000467 Method, system and program product for monitoring rate of volume change of coolant within a cooling system Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Randy J. Zoodsma 2006-02-21
6973801 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons 2005-12-13
6970355 Frame level partial cooling boost for drawer and/or node level processors Michael J. Ellsworth, Jr., Bret W. Lehman, Jason A. Matteson 2005-11-29
6967841 Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons 2005-11-22
6924981 Method for combined air and liquid cooling of stacked electronics components Richard C. Chu, Michael J. Ellsworth, Jr., Edward F. Furey, Robert E. Simons 2005-08-02
6819563 Method and system for cooling electronics racks using pre-cooled air Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons 2004-11-16
6788085 Self-aligning wafer burn-in probe Budy D. Notohardjono 2004-09-07
6775137 Method and apparatus for combined air and liquid cooling of stacked electronics components Richard C. Chu, Michael J. Ellsworth, Jr., Edward F. Furey, Robert E. Simons 2004-08-10
6754076 Stackable liquid cooling pump William E. Cox 2004-06-22
6714412 Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons 2004-03-30
6684501 Foil heat sink and a method for fabricating same Michael J. Ellsworth, Jr., Egidio Marotta, Budy D. Notohardjono, Prabjit Singh 2004-02-03
6639803 Compliant heat sink device/mounting system interconnect and a method of implementing same Joseph P. Corrado, Budy D. Notohardjono 2003-10-28
6511574 Fixture for securing hard stops to a substrate Dennis R. Barringer, Mark A. Marnell, Steven J. Mazzuca, Donald W. Porter, Wade H. White 2003-01-28
6499717 System and method of use for a refrigerant quick-connect coupling Donald W. Porter, Mark A. Marnell, Steven J. Mazzuca, Budy D. Notohardjono 2002-12-31
6496001 System and method for probe mechanism planarization Dennis R. Barringer, Donald W. Porter, Wade H. White 2002-12-17
6449162 Removable land grid array cooling solution John Saunders Corbin, Jr., Victor H. Mahaney, Jr. 2002-09-10
6275051 Segmented architecture for wafer test and burn-in Thomas W. Bachelder, Dennis R. Barringer, Dennis R. Conti, James M. Crafts, David L. Gardell +5 more 2001-08-14
6265887 Mounting fixture for a pin grid array device Dennis R. Barringer, Drew R. Horvath 2001-07-24
6262582 Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom Dennis R. Barringer, Mark R. LaForce, Mark A. Marnell, Donald W. Porter, Wade H. White 2001-07-17
6255832 Flexible wafer level probe Budy D. Notohardjono, Prabjit Singh 2001-07-03
6246581 Heated PCB interconnect for cooled IC chip modules Sukhvinder S. Kang, Howard Victor Mahaney, Jr., Prabjit Singh 2001-06-12
6243268 Cooled IC chip modules with an insulated circuit board Sukhvinder S. Kang, Howard Victor Mahaney, Jr., Prabjit Singh 2001-06-05
6233960 Spot cooling evaporator cooling system for integrated circuit chip modules Sukhvinder S. Kang, Howard Victor Mahaney, Jr., Prabjit Singh 2001-05-22