Issued Patents All Time
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141503 | Selective phase change material growth in high aspect ratio dielectric pores for semiconductor device fabrication | Matthew J. BrightSky, Takeshi Masuda | 2018-11-27 |
| 10128185 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe | 2018-11-13 |
| 10121676 | Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch | Eric A. Joseph, Joe Lee, Takefumi Suzuki | 2018-11-06 |
| 9977002 | Nanoporous structures by reactive ion etching | Yann Astier, Jingwei Bai, Aaron D. Franklin, Joshua T. Smith | 2018-05-22 |
| 9934984 | Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication | Eric A. Joseph, Joe Lee, Takefumi Suzuki | 2018-04-03 |
| 9868119 | Pillar array structure with uniform and high aspect ratio nanometer gaps | Yann Astier, Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2018-01-16 |
| 9773698 | Method of manufacturing an ultra low dielectric layer | Geraud Jean-Michel Dubois, Gregory M. Fritz, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Willi Volksen | 2017-09-26 |
| 9653395 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe | 2017-05-16 |
| 9646881 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe | 2017-05-09 |
| 9636675 | Pillar array structure with uniform and high aspect ratio nanometer gaps | Yann Astier, Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2017-05-02 |
| 9633948 | Low energy etch process for nitrogen-containing dielectric layer | Markus Brink, Sebastian U. Engelmann, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura | 2017-04-25 |
| 9615851 | Method and apparatus for insertion of a sensor | Mark Neinast, W. Kenneth Ward, Richard G. Sass, Jon A. Fortuna | 2017-04-11 |
| 9536731 | Wet clean process for removing CxHyFz etch residue | Sebastian U. Engelmann, Eric A. Joseph, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more | 2017-01-03 |
| 9424596 | Method and system for implementing a virtual game | Colin Snyder | 2016-08-23 |
| 9214335 | Surface plasma modification of porous thin-films to optimize pore filling | Geraud J. Dubois, Theo J. Frot, Krystelle Lionti, Teddie Peregrino Magbitang, Willi Volksen | 2015-12-15 |
| 9190316 | Low energy etch process for nitrogen-containing dielectric layer | Markus Brink, Sebastian U. Engelmann, Nicholas C. M. Fuller, Hiroyuki Miyazoe, Masahiro Nakamura | 2015-11-17 |
| 9117652 | Nanoporous structures by reactive ion etching | Yann Astier, Jingwei Bai, Aaron D. Franklin, Joshua T. Smith | 2015-08-25 |
| 9054160 | Interconnect structure and method for fabricating on-chip interconnect structures by image reversal | Qinghuang Lin, Alshakim Nelson, Satyanarayana V. Nitta, Dirk Pfeiffer, Jitendra S. Rathore | 2015-06-09 |
| 9042298 | Method and apparatus for enabling internet-based emergency calls | — | 2015-05-26 |
| 8994177 | Far back end of the line stack encapsulation | Tymon Barwicz, Swetha Kamlapurkar | 2015-03-31 |
| 8932956 | Far back end of the line stack encapsulation | Tymon Barwicz, Swetha Kamlapurkar | 2015-01-13 |
| 8927430 | Overburden removal for pore fill integration approach | Geraud Jean-Michel Dubois, Theo J. Frot, Willi Volksen | 2015-01-06 |
| 8845530 | Resposable biosensor assembly and method of sensing | Richard G. Sass, W. Kenneth Ward | 2014-09-30 |
| 8629769 | Method and system for communication between wireless devices | — | 2014-01-14 |
| 8597117 | Method and system for implementing a virtual game | Colin Snyder | 2013-12-03 |