Issued Patents All Time
Showing 176–200 of 293 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7830664 | Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2010-11-09 |
| 7788941 | Cooling system and method utilizing thermal capacitor unit(s) for enhanced thermal energy transfer efficiency | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar | 2010-09-07 |
| 7787248 | Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2010-08-31 |
| 7762314 | Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2010-07-27 |
| 7731079 | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more | 2010-06-08 |
| 7724524 | Hybrid immersion cooled server with integral spot and bath cooling | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar | 2010-05-25 |
| 7707880 | Monitoring method and system for determining rack airflow rate and rack power consumption | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar | 2010-05-04 |
| 7665325 | Multi-fluid cooling system and method with freeze protection for cooling an electronic device | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2010-02-23 |
| 7660121 | System of facilitating cooling of electronics racks of a data center employing multiple cooling stations | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2010-02-09 |
| 7657347 | Temperature-based monitoring method and system for determining first and second fluid flow rates through a heat exchanger | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar | 2010-02-02 |
| 7642914 | Auto-locating system and method for data center mapping and monitoring | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar | 2010-01-05 |
| 7641101 | Method of assembling a cooling system for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2010-01-05 |
| 7639499 | Liquid cooling apparatus and method for facilitating cooling of an electronics system | Levi A. Campbell, Richard C. Chu, Martin Joseph Crippen, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +3 more | 2009-12-29 |
| 7639498 | Conductive heat transport cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink +1 more | 2009-12-29 |
| 7630795 | Method and air-cooling unit with dynamic airflow and heat removal adjustability | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-12-08 |
| 7609519 | Coolant control unit and cooled electronics system employing the same | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-10-27 |
| 7593227 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Donald W. Porter +1 more | 2009-09-22 |
| 7518871 | Liquid-based cooling system for cooling a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-04-14 |
| 7511957 | Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-03-31 |
| 7492593 | Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-02-17 |
| 7486514 | Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-02-03 |
| 7486512 | Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-02-03 |
| 7477514 | Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2009-01-13 |
| 7459112 | Method of fabrication for a thermal spreader using thermal conduits | Richard C. Chu, Michael J. Ellsworth, Jr. | 2008-12-02 |
| 7450385 | Liquid-based cooling apparatus for an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-11-11 |