| 7830664 |
Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2010-11-09 |
$6,046,000 |
| 7788941 |
Cooling system and method utilizing thermal capacitor unit(s) for enhanced thermal energy transfer efficiency |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2010-09-07 |
$2,081,000 |
| 7787248 |
Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2010-08-31 |
$3,369,000 |
| 7762314 |
Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2010-07-27 |
$6,569,000 |
| 7731079 |
Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more |
2010-06-08 |
$3,517,000 |
| 7724524 |
Hybrid immersion cooled server with integral spot and bath cooling |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2010-05-25 |
$4,007,000 |
| 7707880 |
Monitoring method and system for determining rack airflow rate and rack power consumption |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2010-05-04 |
$4,679,000 |
| 7665325 |
Multi-fluid cooling system and method with freeze protection for cooling an electronic device |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2010-02-23 |
$6,192,000 |
| 7660121 |
System of facilitating cooling of electronics racks of a data center employing multiple cooling stations |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2010-02-09 |
$5,437,000 |
| 7657347 |
Temperature-based monitoring method and system for determining first and second fluid flow rates through a heat exchanger |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2010-02-02 |
$8,575,000 |
| 7642914 |
Auto-locating system and method for data center mapping and monitoring |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2010-01-05 |
$14,762,000 |
| 7641101 |
Method of assembling a cooling system for a multi-component electronics system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2010-01-05 |
$14,762,000 |
| 7639499 |
Liquid cooling apparatus and method for facilitating cooling of an electronics system |
Levi A. Campbell, Richard C. Chu, Martin Joseph Crippen, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +3 more |
2009-12-29 |
$22,760,000 |
| 7639498 |
Conductive heat transport cooling system and method for a multi-component electronics system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink +1 more |
2009-12-29 |
$22,760,000 |
| 7630795 |
Method and air-cooling unit with dynamic airflow and heat removal adjustability |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-12-08 |
$16,023,000 |
| 7609519 |
Coolant control unit and cooled electronics system employing the same |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-10-27 |
$16,602,000 |
| 7593227 |
Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Donald W. Porter +1 more |
2009-09-22 |
$18,778,000 |
| 7518871 |
Liquid-based cooling system for cooling a multi-component electronics system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-04-14 |
$4,368,000 |
| 7511957 |
Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-03-31 |
$5,042,000 |
| 7492593 |
Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-02-17 |
$3,763,000 |
| 7486514 |
Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-02-03 |
$3,057,000 |
| 7486512 |
Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-02-03 |
$3,057,000 |
| 7477514 |
Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2009-01-13 |
$4,505,000 |
| 7459112 |
Method of fabrication for a thermal spreader using thermal conduits |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2008-12-02 |
$5,263,000 |
| 7450385 |
Liquid-based cooling apparatus for an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-11-11 |
$10,353,000 |
