| 8583290 |
Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2013-11-12 |
$8,268,000 |
| 8564952 |
Flow boiling heat sink structure with vapor venting and condensing |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar |
2013-10-22 |
$5,163,000 |
| 8490679 |
Condenser fin structures facilitating vapor condensation cooling of coolant |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2013-07-23 |
$2,085,000 |
| 8472182 |
Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2013-06-25 |
$6,528,000 |
| 8387249 |
Apparatus and method for facilitating servicing of a liquid-cooled electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Prabjit Singh |
2013-03-05 |
$6,102,000 |
| 8369091 |
Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2013-02-05 |
$5,221,000 |
| 8351206 |
Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2013-01-08 |
$4,312,000 |
| 8345423 |
Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2013-01-01 |
|
| 8322029 |
Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Keith F. Fogel, Madhusudan K. Iyengar +1 more |
2012-12-04 |
$3,998,000 |
| 8322154 |
Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-12-04 |
$3,998,000 |
| 8274790 |
Automatically reconfigurable liquid-cooling apparatus for an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink |
2012-09-25 |
$5,997,000 |
| 8266802 |
Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2012-09-18 |
$5,189,000 |
| 8248801 |
Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-08-21 |
$4,162,000 |
| 8230906 |
Dual-chamber fluid pump for a multi-fluid electronics cooling system and method |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2012-07-31 |
$5,473,000 |
| 8208258 |
System and method for facilitating parallel cooling of liquid-cooled electronics racks |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-06-26 |
$15,244,000 |
| 8203842 |
Open flow cold plate for immersion-cooled electronic packages |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-06-19 |
$12,855,000 |
| 8194406 |
Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-06-05 |
$5,238,000 |
| 8189334 |
Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-05-29 |
$10,419,000 |
| 8184436 |
Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-05-22 |
$8,891,000 |
| 8179677 |
Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-05-15 |
$8,909,000 |
| 8141621 |
Apparatus and method for providing in situ cooling of computer data centers during service calls |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-03-27 |
$9,873,000 |
| 8144467 |
Dehumidifying and re-humidifying apparatus and method for an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-03-27 |
$9,873,000 |
| 8094453 |
Compliant conduction rail assembly and method facilitating cooling of an electronics structure |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2012-01-10 |
$7,380,000 |
| 8081461 |
Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-12-20 |
$11,265,000 |
| 8059405 |
Condenser block structures with cavities facilitating vapor condensation cooling of coolant |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-11-15 |
$18,116,000 |
