| 8929080 |
Immersion-cooling of selected electronic component(s) mounted to printed circuit board |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-01-06 |
$2,134,000 |
| 8925333 |
Thermoelectric-enhanced air and liquid cooling of an electronic system |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-01-06 |
$2,134,000 |
| 8922998 |
Coolant manifold with separately rotatable manifold section(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2014-12-30 |
$7,309,000 |
| 8899052 |
Thermoelectric-enhanced, refrigeration cooling of an electronic component |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-12-02 |
$2,384,000 |
| 8879257 |
Combined power and cooling rack supporting an electronics rack(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-11-04 |
$3,955,000 |
| 8867209 |
Two-phase, water-based immersion-cooling apparatus with passive deionization |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar +1 more |
2014-10-21 |
$3,429,000 |
| 8857057 |
Apparatus and method for facilitating servicing of a liquid-cooled electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Prabjit Singh |
2014-10-14 |
$3,785,000 |
| 8833096 |
Heat exchange assembly with integrated heater |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-09-16 |
$3,547,000 |
| 8824143 |
Combined power and cooling rack supporting an electronics rack(S) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-09-02 |
$3,373,000 |
| 8817474 |
Multi-rack assembly with shared cooling unit |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-08-26 |
$4,445,000 |
| 8817465 |
Multi-rack assembly with shared cooling apparatus |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-08-26 |
$4,445,000 |
| 8813515 |
Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-08-26 |
$4,445,000 |
| 8806749 |
Two-phase, water-based immersion-cooling apparatus with passive deionization |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2014-08-19 |
$3,895,000 |
| 8797740 |
Multi-rack assembly method with shared cooling unit |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-08-05 |
$3,332,000 |
| 8789385 |
Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-07-29 |
$5,690,000 |
| 8783052 |
Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-07-22 |
$5,473,000 |
| 8760863 |
Multi-rack assembly with shared cooling apparatus |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-06-24 |
$6,231,000 |
| 8743545 |
Thermal expansion-enhanced heat sink for an electronic assembly |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2014-06-03 |
$4,638,000 |
| 8739406 |
Vapor condenser with three-dimensional folded structure |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2014-06-03 |
$4,638,000 |
| 8720063 |
Thermal expansion-enhanced heat sink for an electronic assembly |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madnusudan K. Iyengar +1 more |
2014-05-13 |
$6,724,000 |
| 8713957 |
Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-05-06 |
$5,370,000 |
| 8713955 |
Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus |
Levi A. Campbell, Richard C. Chu, Evan G. Colgan, Milnes P. David, Michael J. Ellsworth, Jr. +1 more |
2014-05-06 |
$5,370,000 |
| 8711563 |
Dry-cooling unit with gravity-assisted coolant flow |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-04-29 |
$5,775,000 |
| 8689861 |
Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2014-04-08 |
$7,562,000 |
| 8619425 |
Multi-fluid, two-phase immersion-cooling of electronic component(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2013-12-31 |
$6,686,000 |
