Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal expansion-enhanced heat sink for an electronic assembly

Thermal expansion-enhanced heat sink for an electronic assembly

US Patent 8720063 · Granted May 13, 2014

Estimated economic value: $6,724,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Isolating temperature fluctuation in an electronics enclosure2025
Portable inspection, collection, and delivery apparatus for fluid-based systems2024
Display screen or portion thereof with a graphical user interface2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly2024
Cryptographic hardware security module with secure embedded heat pipe2024
Cooling apparatuses with physically-powered, mechanical coolant pumps2024
Cooling apparatuses with physically-powered, mechanical coolant pumps2024
Hybrid in-drawer computer equipment cooling device2023
Applying a solderable surface to conductive ink2023
Constant temperature closed-loop airflow containment2023
Tamper-respondent assemblies with pressure connector assemblies2023
Tamper-respondent assemblies with porous heat transfer element(s)2023