Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8720063 | Thermal expansion-enhanced heat sink for an electronic assembly | Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Robert E. Simons +1 more | 2014-05-13 |