| 8051897 |
Redundant assembly for a liquid and air cooled module |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2011-11-08 |
$3,097,000 |
| 8027162 |
Liquid-cooled electronics apparatus and methods of fabrication |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Michael Rizzolo |
2011-09-27 |
$6,526,000 |
| 8020298 |
Method of fabricating a heat exchanger with angled secondary fins extending from primary fins |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2011-09-20 |
$5,575,000 |
| 8018720 |
Condenser structures with fin cavities facilitating vapor condensation cooling of coolant |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-09-13 |
$4,804,000 |
| 8014150 |
Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-09-06 |
$5,472,000 |
| 7990709 |
Apparatus and method for facilitating cooling of an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-08-02 |
$4,890,000 |
| 7983040 |
Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-07-19 |
$6,687,000 |
| 7978473 |
Cooling apparatus with cold plate formed in situ on a surface to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more |
2011-07-12 |
$4,098,000 |
| 7978472 |
Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-07-12 |
$4,098,000 |
| 7967062 |
Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Keith E. Fogel, Madhusudan K. Iyengar +1 more |
2011-06-28 |
$4,369,000 |
| 7963119 |
Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-06-21 |
$7,220,000 |
| 7965509 |
High performance dual-in-line memory (DIMM) array liquid cooling assembly and method |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Maurice F. Holahan, Madhusudan K. Iyengar +1 more |
2011-06-21 |
$7,220,000 |
| 7961475 |
Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Vinod Kamath |
2011-06-14 |
$3,503,000 |
| 7948757 |
Multi-fluid cooling of an electronic device |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2011-05-24 |
$5,693,000 |
| 7944694 |
Liquid cooling apparatus and method for cooling blades of an electronic system chassis |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-05-17 |
$5,524,000 |
| 7918025 |
Method of fabricating a thermal spreader having thermal conduits |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2011-04-05 |
$6,033,000 |
| 7913387 |
Method of fabricating a thermal spreader having thermal conduits |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2011-03-29 |
$5,031,000 |
| 7916483 |
Open flow cold plate for liquid cooled electronic packages |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-03-29 |
$5,031,000 |
| 7907406 |
System and method for standby mode cooling of a liquid-cooled electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-03-15 |
$6,222,000 |
| 7905096 |
Dehumidifying and re-humidifying air cooling for an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-03-15 |
$6,222,000 |
| 7885074 |
Direct jet impingement-assisted thermosyphon cooling apparatus and method |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-02-08 |
$4,016,000 |
| 7885070 |
Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-02-08 |
$4,016,000 |
| 7878007 |
Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2011-02-01 |
$3,711,000 |
| 7841385 |
Dual-chamber fluid pump for a multi-fluid electronics cooling system and method |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2010-11-30 |
$3,507,000 |
| 7830657 |
Apparatus for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack |
Richard C. Chu, Michael J. Ellsworth, Jr., Donald W. Porter, Roger R. Schmidt |
2010-11-09 |
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