Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem

Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem

US Patent 7983040 · Granted Jul 19, 2011

Estimated economic value: $6,687,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Modular liquid cooling architecture for liquid cooling2025
Continuous feed liquid coolant replacement2025
Spring loaded compliant coolant distribution manifold for direct liquid cooled m2025
Integrated circuit with a ring-shaped hot spot area and multidirectional cooling2025
Direct liquid cooling with O-ring sealing2025
Methods and heat distribution devices for thermal management of chip assemblies2025
Modular liquid cooling architecture for liquid cooling2024
Portable inspection, collection, and delivery apparatus for fluid-based systems2024
Display screen or portion thereof with a graphical user interface2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly2024
Methods and heat distribution devices for thermal management of chip assemblies2024
Cryptographic hardware security module with secure embedded heat pipe2024