Issued Patents All Time
Showing 201–225 of 293 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7420808 | Liquid-based cooling system for cooling a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-09-02 |
| 7408776 | Conductive heat transport cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink +1 more | 2008-08-05 |
| 7405936 | Hybrid cooling system for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-07-29 |
| 7400504 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-07-15 |
| 7400505 | Hybrid cooling system and method for a multi-component electronics system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-07-15 |
| 7397661 | Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-07-08 |
| 7385817 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-06-10 |
| 7385810 | Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack | Richard C. Chu, Michael J. Ellsworth, Jr., Donald W. Porter, Roger R. Schmidt | 2008-06-10 |
| 7380409 | Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Donald W. Porter +1 more | 2008-06-03 |
| 7375962 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-05-20 |
| 7362574 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-04-22 |
| 7353861 | Transpiration cooled heat sink and a self contained coolant supply for same | Richard C. Chu, Michael J. Ellsworth, Jr. | 2008-04-08 |
| 7349213 | Coolant control unit, and cooled electronics system and method employing the same | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-03-25 |
| 7349209 | Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2008-03-25 |
| 7301770 | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2007-11-27 |
| 7298618 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-11-20 |
| 7298617 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-11-20 |
| 7286351 | Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-10-23 |
| 7283358 | Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region | Levi A. Campbell, Ricahrd C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-10-16 |
| 7277283 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-10-02 |
| 7274566 | Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-09-25 |
| 7270174 | Method, system and program product for automatically checking coolant loops of a cooling system for a computing environment | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Randy J. Zoodsma | 2007-09-18 |
| 7272005 | Multi-element heat exchange assemblies and methods of fabrication for a cooling system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-09-18 |
| 7233494 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-06-19 |
| 7206203 | Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-04-17 |