| 7420808 |
Liquid-based cooling system for cooling a multi-component electronics system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-09-02 |
$13,493,000 |
| 7408776 |
Conductive heat transport cooling system and method for a multi-component electronics system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Randall G. Kemink +1 more |
2008-08-05 |
$7,485,000 |
| 7405936 |
Hybrid cooling system for a multi-component electronics system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-07-29 |
$9,815,000 |
| 7400504 |
Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-07-15 |
$7,406,000 |
| 7400505 |
Hybrid cooling system and method for a multi-component electronics system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-07-15 |
$7,406,000 |
| 7397661 |
Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-07-08 |
$9,414,000 |
| 7385817 |
Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-06-10 |
$5,963,000 |
| 7385810 |
Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack |
Richard C. Chu, Michael J. Ellsworth, Jr., Donald W. Porter, Roger R. Schmidt |
2008-06-10 |
$5,963,000 |
| 7380409 |
Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Donald W. Porter +1 more |
2008-06-03 |
$7,325,000 |
| 7375962 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-05-20 |
$8,483,000 |
| 7362574 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-04-22 |
$8,943,000 |
| 7353861 |
Transpiration cooled heat sink and a self contained coolant supply for same |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2008-04-08 |
$6,866,000 |
| 7349213 |
Coolant control unit, and cooled electronics system and method employing the same |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-03-25 |
$5,860,000 |
| 7349209 |
Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2008-03-25 |
$5,860,000 |
| 7301770 |
Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more |
2007-11-27 |
$7,635,000 |
| 7298618 |
Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-11-20 |
$7,065,000 |
| 7298617 |
Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-11-20 |
$7,065,000 |
| 7286351 |
Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-10-23 |
$7,617,000 |
| 7283358 |
Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region |
Levi A. Campbell, Ricahrd C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-10-16 |
$5,691,000 |
| 7277283 |
Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-10-02 |
$8,802,000 |
| 7274566 |
Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-09-25 |
$7,894,000 |
| 7270174 |
Method, system and program product for automatically checking coolant loops of a cooling system for a computing environment |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Randy J. Zoodsma |
2007-09-18 |
$6,075,000 |
| 7272005 |
Multi-element heat exchange assemblies and methods of fabrication for a cooling system |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-09-18 |
$6,075,000 |
| 7233494 |
Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-06-19 |
$11,844,000 |
| 7206203 |
Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-04-17 |
$6,339,000 |
