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Home › Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins

US Patent 7233494 · Granted Jun 19, 2007

Estimated economic value: $11,844,000 ⓘ

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