Issued Patents All Time
Showing 226–250 of 293 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7184269 | Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2007-02-27 |
| 7104081 | Condensate removal system and method for facilitating cooling of an electronics system | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt | 2006-09-12 |
| 7106590 | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Randy J. Zoodsma | 2006-09-12 |
| 7086247 | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2006-08-08 |
| 7088585 | Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Takeshi Tsukamoto | 2006-08-08 |
| 7059389 | Integrated cooling unit | Richard C. Chu, Michael J. Ellsworth, Jr. | 2006-06-13 |
| 7012807 | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt | 2006-03-14 |
| 7000467 | Method, system and program product for monitoring rate of volume change of coolant within a cooling system | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Randy J. Zoodsma | 2006-02-21 |
| 6973801 | Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt | 2005-12-13 |
| 6967841 | Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt | 2005-11-22 |
| 6940712 | Electronic device substrate assembly with multilayer impermeable barrier and method of making | Richard C. Chu, Michael J. Ellsworth, Jr., Prabjit Singh, Paul A. Zucco | 2005-09-06 |
| 6924981 | Method for combined air and liquid cooling of stacked electronics components | Richard C. Chu, Michael J. Ellsworth, Jr., Edward F. Furey, Roger R. Schmidt | 2005-08-02 |
| 6821625 | Thermal spreader using thermal conduits | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-11-23 |
| 6820684 | Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader | Richard C. Chu, Micheal J. Ellsworth, Jr. | 2004-11-23 |
| 6819563 | Method and system for cooling electronics racks using pre-cooled air | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt | 2004-11-16 |
| 6804966 | Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-10-19 |
| 6775137 | Method and apparatus for combined air and liquid cooling of stacked electronics components | Richard C. Chu, Michael J. Ellsworth, Jr., Edward F. Furey, Roger R. Schmidt | 2004-08-10 |
| 6767766 | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-07-27 |
| 6714412 | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use | Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt | 2004-03-30 |
| 6705089 | Two stage cooling system employing thermoelectric modules | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-03-16 |
| 6674642 | Liquid-to-air cooling system for portable electronic and computer devices | Richard C. Chu, Michael J. Ellsworth, Jr. | 2004-01-06 |
| 6650538 | Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof | Richard C. Chu, Michael J. Ellsworth, Jr. | 2003-11-18 |
| 6591898 | Integrated heat sink system for a closed electronics container | Richard C. Chu, Michael J. Ellsworth, Jr. | 2003-07-15 |
| 6587336 | Cooling system for portable electronic and computer devices | Richard C. Chu, Michael J. Ellsworth, Jr. | 2003-07-01 |
| 6587345 | Electronic device substrate assembly with impermeable barrier and method of making | Richard C. Chu, Michael J. Ellsworth, Jr., Prabjit Singh | 2003-07-01 |