| 7184269 |
Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2007-02-27 |
$7,582,000 |
| 7104081 |
Condensate removal system and method for facilitating cooling of an electronics system |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt |
2006-09-12 |
$4,301,000 |
| 7106590 |
Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Randy J. Zoodsma |
2006-09-12 |
$4,301,000 |
| 7086247 |
Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2006-08-08 |
$2,377,000 |
| 7088585 |
Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Takeshi Tsukamoto |
2006-08-08 |
$2,377,000 |
| 7059389 |
Integrated cooling unit |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2006-06-13 |
$6,535,000 |
| 7012807 |
Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt |
2006-03-14 |
$11,601,000 |
| 7000467 |
Method, system and program product for monitoring rate of volume change of coolant within a cooling system |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Randy J. Zoodsma |
2006-02-21 |
$6,384,000 |
| 6973801 |
Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt |
2005-12-13 |
$5,273,000 |
| 6967841 |
Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt |
2005-11-22 |
$6,353,000 |
| 6940712 |
Electronic device substrate assembly with multilayer impermeable barrier and method of making |
Richard C. Chu, Michael J. Ellsworth, Jr., Prabjit Singh, Paul A. Zucco |
2005-09-06 |
$5,379,000 |
| 6924981 |
Method for combined air and liquid cooling of stacked electronics components |
Richard C. Chu, Michael J. Ellsworth, Jr., Edward F. Furey, Roger R. Schmidt |
2005-08-02 |
$7,293,000 |
| 6821625 |
Thermal spreader using thermal conduits |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2004-11-23 |
$4,043,000 |
| 6820684 |
Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader |
Richard C. Chu, Micheal J. Ellsworth, Jr. |
2004-11-23 |
$4,043,000 |
| 6819563 |
Method and system for cooling electronics racks using pre-cooled air |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt |
2004-11-16 |
$5,414,000 |
| 6804966 |
Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2004-10-19 |
$7,667,000 |
| 6775137 |
Method and apparatus for combined air and liquid cooling of stacked electronics components |
Richard C. Chu, Michael J. Ellsworth, Jr., Edward F. Furey, Roger R. Schmidt |
2004-08-10 |
$6,982,000 |
| 6767766 |
Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2004-07-27 |
$9,809,000 |
| 6714412 |
Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use |
Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt |
2004-03-30 |
$9,421,000 |
| 6705089 |
Two stage cooling system employing thermoelectric modules |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2004-03-16 |
$17,709,000 |
| 6674642 |
Liquid-to-air cooling system for portable electronic and computer devices |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2004-01-06 |
$7,683,000 |
| 6650538 |
Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2003-11-18 |
$6,722,000 |
| 6591898 |
Integrated heat sink system for a closed electronics container |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2003-07-15 |
$18,764,000 |
| 6587345 |
Electronic device substrate assembly with impermeable barrier and method of making |
Richard C. Chu, Michael J. Ellsworth, Jr., Prabjit Singh |
2003-07-01 |
$13,647,000 |
| 6587336 |
Cooling system for portable electronic and computer devices |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2003-07-01 |
$13,647,000 |
