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Robert E. Simons — 293 Patents

IBM: 290 patents #77 of 70,183Top 1%

Poughkeepsie, NY: #4 of 1,613 inventorsTop 1%

New York: #61 of 115,490 inventorsTop 1%

Overall (All Time): #1,396 of 4,157,543Top 1%

293 Patents All Time

Robert E. Simons has been granted 293 US patents while listed as an inventor at IBM. The first was granted in 1980 and the most recent in September 2021. Robert E. Simons ranks #1,396 of 4,157,543 US inventors in our database (top 0.03%). Patent records list Robert E. Simons in Poughkeepsie, NY, US.

Patents per Year

Issued Patents All Time

Showing 276–293 of 293 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
5615084	Enhanced flow distributor for integrated circuit spot coolers	Timothy Anderson, Gregory M. Chrysler	1997-03-25	$8,853,000
5609201	Enhanced flow distributor for integrated circuit spot coolers	Timothy Anderson, Gregory M. Chrysler	1997-03-11	$14,179,000
5609202	Enhanced flow distributor for integrated circuit spot coolers	Timothy Anderson, Gregory M. Chrysler	1997-03-11	$14,179,000
5482113	Convertible heat exchanger for air or water cooling of electronic circuit components and the like	Dereje Agonafer, Timothy Anderson, Gregory M. Chrysler, Richard C. Chu, David T. Vader	1996-01-09	$10,524,000
5456081	Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability	Gregory M. Chrysler, Richard C. Chu, David T. Vader	1995-10-10	$16,991,000
5437328	Multi-stage heat sink	—	1995-08-01	$27,647,000
5412536	Local condensation control for liquid impingement two-phase cooling	Timothy Anderson, Gregory M. Chrysler, Richard C. Chu	1995-05-02	$11,222,000
5394299	Topology matched conduction cooling module	Richard C. Chu, Michael J. Ellsworth, Jr., David T. Vader	1995-02-28	$10,414,000
5370178	Convertible cooling module for air or water cooling of electronic circuit components	Dereje Agonafer, Timothy Anderson, Gregory M. Chrysler, Richard Chao-Fan Chu, David T. Vader	1994-12-06	$9,516,000
5269372	Intersecting flow network for a cold plate cooling system	Richard C. Chu, Michael J. Ellsworth, Jr., David T. Vader	1993-12-14	$15,529,000
5170319	Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels	Richard Chao-Fan Chu, Michael J. Ellsworth, Jr., Gary F. Goth, Michael L. Zumbrunnen	1992-12-08	$8,349,000
5161089	Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same	Richard C. Chu, Michael J. Ellsworth, Jr., Gary F. Goth, Michael L. Zumbrunnen	1992-11-03	$14,331,000
5097385	Super-position cooling	Richard Chao-Fan Chu, David T. Vader	1992-03-17	$18,922,000
4928207	Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston	Gregory M. Chrysler, Richard C. Chu	1990-05-22	$17,701,000
4757370	Circuit package cooling technique with liquid film spreading downward across package surface without separation	Dereje Agonafer, Richard C. Chu	1988-07-12	$23,735,000
4709754	Heat transfer element with nucleate boiling surface and bimetallic fin formed from element	Richard C. Chu	1987-12-01	$37,249,000
4233644	Dual-pull air cooling for a computer frame	Un-Pah Hwang	1980-11-11	$29,958,000
4193445	Conduction cooled module	Richard C. Chu, Un-Pah Hwang	1980-03-18	$22,317,000

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