Issued Patents All Time
Showing 276–293 of 293 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5615084 | Enhanced flow distributor for integrated circuit spot coolers | Timothy Anderson, Gregory M. Chrysler | 1997-03-25 |
| 5609201 | Enhanced flow distributor for integrated circuit spot coolers | Timothy Anderson, Gregory M. Chrysler | 1997-03-11 |
| 5609202 | Enhanced flow distributor for integrated circuit spot coolers | Timothy Anderson, Gregory M. Chrysler | 1997-03-11 |
| 5482113 | Convertible heat exchanger for air or water cooling of electronic circuit components and the like | Dereje Agonafer, Timothy Anderson, Gregory M. Chrysler, Richard C. Chu, David T. Vader | 1996-01-09 |
| 5456081 | Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability | Gregory M. Chrysler, Richard C. Chu, David T. Vader | 1995-10-10 |
| 5437328 | Multi-stage heat sink | — | 1995-08-01 |
| 5412536 | Local condensation control for liquid impingement two-phase cooling | Timothy Anderson, Gregory M. Chrysler, Richard C. Chu | 1995-05-02 |
| 5394299 | Topology matched conduction cooling module | Richard C. Chu, Michael J. Ellsworth, Jr., David T. Vader | 1995-02-28 |
| 5370178 | Convertible cooling module for air or water cooling of electronic circuit components | Dereje Agonafer, Timothy Anderson, Gregory M. Chrysler, Richard Chao-Fan Chu, David T. Vader | 1994-12-06 |
| 5269372 | Intersecting flow network for a cold plate cooling system | Richard C. Chu, Michael J. Ellsworth, Jr., David T. Vader | 1993-12-14 |
| 5170319 | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels | Richard Chao-Fan Chu, Michael J. Ellsworth, Jr., Gary F. Goth, Michael L. Zumbrunnen | 1992-12-08 |
| 5161089 | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same | Richard C. Chu, Michael J. Ellsworth, Jr., Gary F. Goth, Michael L. Zumbrunnen | 1992-11-03 |
| 5097385 | Super-position cooling | Richard Chao-Fan Chu, David T. Vader | 1992-03-17 |
| 4928207 | Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston | Gregory M. Chrysler, Richard C. Chu | 1990-05-22 |
| 4757370 | Circuit package cooling technique with liquid film spreading downward across package surface without separation | Dereje Agonafer, Richard C. Chu | 1988-07-12 |
| 4709754 | Heat transfer element with nucleate boiling surface and bimetallic fin formed from element | Richard C. Chu | 1987-12-01 |
| 4233644 | Dual-pull air cooling for a computer frame | Un-Pah Hwang | 1980-11-11 |
| 4193445 | Conduction cooled module | Richard C. Chu, Un-Pah Hwang | 1980-03-18 |