| 6557354 |
Thermoelectric-enhanced heat exchanger |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2003-05-06 |
$19,022,000 |
| 6548894 |
Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2003-04-15 |
$16,310,000 |
| 6519151 |
Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2003-02-11 |
$11,665,000 |
| 6490874 |
Recuperative environmental conditioning unit |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-12-10 |
$14,124,000 |
| 6489551 |
Electronic module with integrated thermoelectric cooling assembly |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-12-03 |
$15,579,000 |
| 6431260 |
Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof |
Dereje Agonafer, Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-08-13 |
$10,700,000 |
| 6424533 |
Thermoelectric-enhanced heat spreader for heat generating component of an electronic device |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-07-23 |
$13,664,000 |
| 6397618 |
Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-06-04 |
$11,648,000 |
| 6396700 |
Thermal spreader and interface assembly for heat generating component of an electronic device |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-05-28 |
$13,038,000 |
| 6366462 |
Electronic module with integral refrigerant evaporator assembly and control system therefore |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-04-02 |
$31,515,000 |
| 6337794 |
Isothermal heat sink with tiered cooling channels |
Dereje Agonafer, Richard C. Chu, Michael J. Ellsworth, Jr. |
2002-01-08 |
$17,918,000 |
| 6301109 |
Isothermal heat sink with cross-flow openings between channels |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2001-10-09 |
$29,916,000 |
| 6301097 |
Inflatable sealing system for low temperature electronic module |
Michael J. Ellsworth, Jr. |
2001-10-09 |
$29,916,000 |
| 6253835 |
Isothermal heat sink with converging, diverging channels |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2001-07-03 |
$26,086,000 |
| 6205796 |
Sub-dew point cooling of electronic systems |
Richard C. Chu, Gregory M. Chrysler |
2001-03-27 |
$29,796,000 |
| 6164076 |
Thermoelectric cooling assembly with thermal space transformer interposed between cascaded thermoelectric stages for improved thermal performance |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2000-12-26 |
$36,095,000 |
| 6144013 |
Local humidity control system for low temperature electronic module |
Richard C. Chu, Michael J. Ellsworth, Jr. |
2000-11-07 |
$39,779,000 |
| 6035655 |
Modular refrigeration system |
Jeffrey J. Hare, Willard S. Harris, Jody A. Hickey, Roger R. Schmidt, Edward J. Seminaro +3 more |
2000-03-14 |
$26,705,000 |
| 6034872 |
Cooling computer systems |
Gregory M. Chrysler, Richard C. Chu, Gary F. Goth |
2000-03-07 |
$24,867,000 |
| 5970731 |
Modular refrigeration system |
Jeffrey J. Hare, Willard S. Harris, Jody A. Hickey, Roger R. Schmidt, Edward J. Seminaro +3 more |
1999-10-26 |
$20,157,000 |
| 5963425 |
Combined air and refrigeration cooling for computer systems |
Gregory M. Chrysler, Richard C. Chu, Gary F. Goth |
1999-10-05 |
$21,756,000 |
| 5954127 |
Cold plate for dual refrigeration system |
Gregory M. Chrysler, Richard C. Chu, Gary F. Goth |
1999-09-21 |
$27,467,000 |
| 5934364 |
Cold plate for dual refrigeration systems |
Gregory M. Chrysler, Richard C. Chu, Gary F. Goth |
1999-08-10 |
$20,467,000 |
| 5896922 |
Cold plate for dual refrigeration systems |
Gregory M. Chrysler, Richard C. Chu, Gary F. Goth |
1999-04-27 |
$19,884,000 |
| 5704419 |
Air flow distribution in integrated circuit spot coolers |
Dereje Agonafer, Timothy Anderson, Gregory M. Chrysler |
1998-01-06 |
$19,122,000 |
