Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic device substrate assembly with impermeable barrier and method of making

Electronic device substrate assembly with impermeable barrier and method of making

US Patent 6587345 · Granted Jul 1, 2003

Estimated economic value: $13,647,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Portable inspection, collection, and delivery apparatus for fluid-based systems2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly2024
Applying a solderable surface to conductive ink2023
Fixture facilitating heat sink fabrication2022
Fixture facilitating heat sink fabrication2022
Customized module lid2022
Multi-coolant heat exchanger for an electronics rack2021
Multi-coolant heat exchanger for an electronics rack2021
Deionized-water cooling for electrical equipment2021
Candle management and extinguishing device2021
Automated managing of a data center installation2021
Facilitating filling a plated through-hole of a circuit board with solder2021