| 9075582 |
Valve controlled, node-level vapor condensation for two-phase heat sink(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-07-07 |
$5,899,000 |
| 9069532 |
Valve controlled, node-level vapor condensation for two-phase heat sink(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar |
2015-06-30 |
$3,617,000 |
| 9067288 |
Heat sink structure with a vapor-permeable membrane for two-phase cooling |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-06-30 |
$3,617,000 |
| 9061383 |
Heat sink structure with a vapor-permeable membrane for two-phase cooling |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-06-23 |
$4,496,000 |
| 9061382 |
Heat sink structure with a vapor-permeable membrane for two-phase cooling |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar |
2015-06-23 |
$4,496,000 |
| 9042099 |
Air-cooling and vapor-condensing door assembly |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-05-26 |
$2,909,000 |
| 9042098 |
Air-cooling and vapor-condensing door assembly |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-05-26 |
$2,909,000 |
| 9038406 |
Dehumidifying cooling apparatus and method for an electronics rack |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-05-26 |
$2,909,000 |
| 9025332 |
Inlet-air-cooling door assembly for an electronics rack |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more |
2015-05-05 |
$8,777,000 |
| 9025331 |
Inlet-air-cooling door assembly for an electronics rack |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more |
2015-05-05 |
$8,777,000 |
| 9013872 |
Dry-cooling unit with gravity-assisted coolant flow |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-04-21 |
$6,169,000 |
| 9009971 |
Wicking and coupling element(s) facilitating evaporative cooling of component(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-04-21 |
$6,169,000 |
| 9009968 |
Coolant manifold with separately rotatable manifold section(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-04-21 |
$6,169,000 |
| 8985847 |
Thermal resistance-based monitoring of cooling of an electronic component |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-03-24 |
$3,177,000 |
| 8966922 |
Air-side economizer facilitating liquid-based cooling of an electronics rack |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-03-03 |
$3,627,000 |
| 8964391 |
Sectioned manifolds facilitating pumped immersion-cooling of electronic components |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-02-24 |
$3,851,000 |
| 8964390 |
Sectioned manifolds facilitating pumped immersion-cooling of electronic components |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-02-24 |
$3,851,000 |
| 8959941 |
Data center cooling with an air-side economizer and liquid-cooled electronics rack(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar +1 more |
2015-02-24 |
$3,851,000 |
| 8955347 |
Air-side economizer facilitating liquid-based cooling of an electronics rack |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar +1 more |
2015-02-17 |
$5,211,000 |
| 8955346 |
Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load |
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-02-17 |
$5,211,000 |
| 8953320 |
Coolant drip facilitating partial immersion-cooling of electronic components |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-02-10 |
|
| 8953317 |
Wicking vapor-condenser facilitating immersion-cooling of electronic component(s) |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar |
2015-02-10 |
$3,717,000 |
| 8947873 |
Immersion-cooled and conduction-cooled electronic system |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-02-03 |
$3,062,000 |
| 8941994 |
Vapor condenser with three-dimensional folded structure |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-01-27 |
$4,313,000 |
| 8934250 |
Immersion-cooling of selected electronic component(s) mounted to printed circuit board |
Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar +1 more |
2015-01-13 |
$4,389,000 |
