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Home › Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled

Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled

US Patent 7511957 · Granted Mar 31, 2009

Estimated economic value: $5,042,000 ⓘ

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