Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
RM

Robert D. Miller

IBM: 175 patents #213 of 70,183Top 1%
FLFca Us Llc.: 8 patents #60 of 1,371Top 5%
Stanford University: 5 patents #598 of 5,197Top 15%
M&Milliken &: 5 patents #151 of 679Top 25%
HBHitachi Global Storage Netherlands, B.V.: 4 patents #2 of 32Top 7%
WGWilson Greatbatch: 3 patents #45 of 90Top 50%
AKAsahi Kasei Kabushiki Kaisha: 3 patents #181 of 1,220Top 15%
GRGreatbatch: 2 patents #158 of 357Top 45%
Honeywell: 2 patents #4,946 of 14,447Top 35%
AMD: 2 patents #3,994 of 9,279Top 45%
HGHGST: 2 patents #738 of 1,677Top 45%
KTKing Abdulaziz City For Science And Technology: 2 patents #134 of 573Top 25%
CCCertainteed Ceilings: 2 patents #16 of 49Top 35%
MSMed-Safe Systems: 2 patents #7 of 9Top 80%
GUGlobalfoundries U.S.: 1 patents #22 of 211Top 15%
Dow Global Technologies: 1 patents #2,632 of 4,534Top 60%
LILund Industries: 1 patents #9 of 22Top 45%
MIT: 1 patents #4,386 of 9,367Top 50%
MRMilliken Research: 1 patents #151 of 275Top 55%
PIPpg Industries: 1 patents #662 of 1,216Top 55%
L'Anse, MI: #1 of 8 inventorsTop 15%
Michigan: #50 of 86,293 inventorsTop 1%
Overall (All Time): #2,814 of 4,157,543Top 1%
216 Patents All Time

Issued Patents All Time

Showing 126–150 of 216 patents

Patent #TitleCo-InventorsDate
7491425 Scanning probe-based lithography method Michel Despont, Urs T. Duerig, Jane Elizabeth Frommer, Bernd W. Gotsmann, James L. Hedrick +1 more 2009-02-17
7482389 Nanoporous media with lamellar structures Jennifer Nam Cha, Geraud Jean-Michel Dubois, James L. Hedrick, Ho-Cheol Kim, Victor Yee-Way Lee +2 more 2009-01-27
7479306 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Michael Lane, Qinghuang Lin +2 more 2009-01-20
7471614 High density data storage medium Jane Elizabeth Frommer, Craig J. Hawker, Urs T. Duerig, Bernd W. Gotsmann, Peter Vettiger +2 more 2008-12-30
7468330 Imprint process using polyhedral oligomeric silsesquioxane based imprint materials Robert David Allen, Richard Anthony DiPietro, Geraud Jean-Michel Dubois, Mark Whitney Hart, Ratnam Sooriyakumaran 2008-12-23
7463572 High density data storage medium Jane Elizabeth Frommer, Craig J. Hawker, Urs T. Duerig, Bernd W. Gotsmann, Peter Vettiger +1 more 2008-12-09
7459183 Method of forming low-K interlevel dielectric layers and structures Geraud Jean-Michel Dubois, James L. Hedrick, Ho-Cheol Kim, Victor Yee-Way Lee, Teddie Peregrino Magbitang +3 more 2008-12-02
7404724 Connector with ESD inhibiting shell 2008-07-29
7368483 Porous composition of matter, and method of making same Eric J. Connor, James P. Godschalx, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee +3 more 2008-05-06
7363809 Methods and systems for providing air data parameters using mass flow and pressure sensors Steven H. Thomas 2008-04-29
7354777 Discrete nano-textured structures in biomolecular arrays, and method of use Mark Whitney Hart, Ho-Cheol Kim, Gregory Michael Wallraff 2008-04-08
7341788 Materials having predefined morphologies and methods of formation thereof Jennifer Nam Cha, James L. Hedrick, Ho-Cheol Kim, Willi Volksen 2008-03-11
7334469 Methods and systems using ratiometric characterizations to improve air data accuracy Steven H. Thomas 2008-02-26
7309754 Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization Phillip Brock, Michael W. Chaw, Dan Dawson, Craig J. Hawker, James L. Hedrick +4 more 2007-12-18
7282241 Patterned, high surface area substrate with hydrophilic/hydrophobic contrast, and method of use Ho-Cheol Kim 2007-10-16
7229934 Porous organosilicates with improved mechanical properties Geraud Jean-Michel Dubois, James L. Hedrick, Ho-Cheol Kim, Victor Yee-Way Lee, Teddie Peregrino Magbitang +2 more 2007-06-12
7214603 Method for fabricating interconnect structures with reduced plasma damage Ronald A. DellaGuardia, Elbert E. Huang, Qinghuang Lin 2007-05-08
7209324 Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers Phillip Brock, Michael W. Chaw, Dan Dawson, Craig J. Hawker, James L. Hedrick +4 more 2007-04-24
7196872 Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization Michael W. Chaw, Dan Dawson, Craig J. Hawker, James L. Hedrick, Wesley L. Hillman +3 more 2007-03-27
7125467 Slider processing system utilizing polyvinyl alcohol release layer Phillip Brock, Michael W. Chaw, Dan Dawson, Craig J. Hawker, James L. Hedrick +7 more 2006-10-24
7112617 Patterned substrate with hydrophilic/hydrophobic contrast, and method of use Ho-Cheol Kim 2006-09-26
7087982 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials Elbert E. Huang, Teddie Peregrino Magbitang, Willi Volksen 2006-08-08
7077970 Sliders bonded by a debondable nonstoichiometric encapsulant Nicholas I. Buchan, Michael W. Chaw, Sean Clemenza, Dan Dawson, Craig J. Hawker +5 more 2006-07-18
7064929 Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers Dennis McKean, Teddie Peregrino Magbitang, James L. Hedrick, Craig J. Hawker, Willi Volksen +4 more 2006-06-20
7056840 Direct photo-patterning of nanoporous organosilicates, and method of use Ho-Cheol Kim, Eric J. Connor, Victor Yee-Way Lee, Gregory Michael Wallraff, Willi Volksen 2006-06-06