RH

Richard Hsiao

IBM: 54 patents #1,518 of 70,183Top 3%
HG HGST: 31 patents #36 of 1,677Top 3%
HB Hgst Netherlands, B.V.: 1 patents #510 of 972Top 55%
📍 Vestal, NY: #3 of 481 inventorsTop 1%
🗺 New York: #756 of 115,490 inventorsTop 1%
Overall (All Time): #19,757 of 4,157,543Top 1%
86
Patents All Time

Issued Patents All Time

Showing 76–86 of 86 patents

Patent #TitleCo-InventorsDate
5930084 Stabilized MR sensor and flux guide joined by contiguous junction Moris Dovek, Robert E. Fontana, Jr., Mohamad Towfik Krounbi, Hugo Alberto Emilio Santini, Virgil S. Speriosu 1999-07-27
5901432 Method for making a thin film inductive write head having a pedestal pole tip and an electroplated gap Michael Armstrong, David Heim, Neil Leslie Robertson, Hugo Alberto Emilio Santini 1999-05-11
5893981 Method of making stabilized MR sensor and flux guide joined by contiguous junction Moris Dovek, Robert E. Fontana, Jr., Mohamad Towfik Krounbi, Hugo Alberto Emilio Santini, Virgil S. Speriosu 1999-04-13
5885750 Tantalum adhesion layer and reactive-ion-etch process for providing a thin film metallization area Neil Leslie Robertson, Hugo Alberto Emilio Santini, Clinton David Snyder 1999-03-23
5867890 Method for making a thin film merged magnetoresistive read/inductive write head having a pedestal pole tip Cherngye Hwang, Neil Leslie Robertson, Hugo Alberto Emilio Santini 1999-02-09
5648113 Aluminum oxide LPCVD system Steven G. Barbee, Jonathan D. Chapple-Sokol, Richard A. Conti, James A. O'Neill, Narayana V. Sarma +3 more 1997-07-15
5540777 Aluminum oxide LPCVD system Steven G. Barbee, Jonathan D. Chapple-Sokol, Richard A. Conti, James A. O'Neill, Narayana V. Sarma +3 more 1996-07-30
5421507 Au-Sn transient liquid bonding in high performance laminates Charles R. Davis, James R. Loomis, Jae Man Park, Jonathan D. Reid 1995-06-06
5292688 Solder interconnection structure on organic substrates and process for making Jack M. McCreary, Voya R. Markovich, Donald P. Seraphim 1994-03-08
5280414 Au-Sn transient liquid bonding in high performance laminates Charles R. Davis, James R. Loomis, Jae Man Park, Jonathan D. Reid 1994-01-18
5121190 Solder interconnection structure on organic substrates Jack M. McCreary, Voya R. Markovich, Donald P. Seraphim 1992-06-09