Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5747101 | Direct chip attachment (DCA) with electrically conductive adhesives | Richard B. Booth, Michael A. Gaynes, Robert M. Murcko, Viswanadham Puligandla, Judith Marie Roldan +1 more | 1998-05-05 |
| 5700398 | Composition containing a polymer and conductive filler and use thereof | Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Sampath Purushothaman, Jane M. Shaw +2 more | 1997-12-23 |
| 5545429 | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess | Richard B. Booth, Emanuel I. Cooper, Edward A. Giess, Mark R. Kordus, Sol Krongelb +3 more | 1996-08-13 |
| 5543585 | Direct chip attachment (DCA) with electrically conductive adhesives | Richard B. Booth, Michael A. Gaynes, Robert M. Murco, Viswanadham Puligandla, Judith Marie Roldan +1 more | 1996-08-06 |
| 5314709 | Unzippable polymer mask for screening operations | Fuad E. Doany, Gary W. Grube | 1994-05-24 |
| 5310580 | Electroless metal adhesion to organic dielectric material with phase separated morphology | Eugene J. O'Sullivan, Terrence R. O'Toole, Judith Marie Roldan, Lubomyr T. Romankiw, Carlos J. Sambucetti | 1994-05-10 |
| 5288842 | Morphological composite materials formed from different precursors | Claudius Feger, Rodney T. Hodgson, David Lewis | 1994-02-22 |
| 5062896 | Solder/polymer composite paste and method | Wu-Song Huang, Igor Y. Khandros, Leathen Shi | 1991-11-05 |