Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5109267 | Method for producing an integrated circuit structure with a dense multilayer metallization pattern | Otto Koblinger | 1992-04-28 |
| 5055383 | Process for making masks with structures in the submicron range | Otto Koblinger, Klaus Meissner, Reinhold Muhl, Werner Zapka | 1991-10-08 |
| 4980317 | Method of producing integrated semiconductor structures comprising field-effect transistors with channel lengths in the submicron range using a three-layer resist system | Otto Koblinger, Reinhold Muhl | 1990-12-25 |
| 4869781 | Method for fabricating a semiconductor integrated circuit structure having a submicrometer length device element | Wolfgang Euen, Dieter Hagmann | 1989-09-26 |
| 4857383 | Synthetic substrate with adhesive metal layer | Johann Greschner, Friedrich W. Schwerdt | 1989-08-15 |
| 4816115 | Process of making via holes in a double-layer insulation | Eva Horner, Reinhold Muhl | 1989-03-28 |
| 4642163 | Method of making adhesive metal layers on substrates of synthetic material and device produced thereby | Johann Greschner, Friedrich W. Schwerdt | 1987-02-10 |
| 4589952 | Method of making trenches with substantially vertical sidewalls in silicon through reactive ion etching | Uwe Behringer, Johann Greschner | 1986-05-20 |
| 4556628 | Process for producing printed circuit boards with metallic conductor structures embedded in the insulating substrate | Johann Greschner, Friedrich W. Schwerdt | 1985-12-03 |
| 4513203 | Mask and system for mutually aligning objects in ray exposure systems | Harald Bohlen, Helmut Engelke, Johann Greschner, Reinhold Muhl, Peter Nehmiz | 1985-04-23 |
| 4502914 | Method of making structures with dimensions in the sub-micrometer range | Johann Greschner | 1985-03-05 |