Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5966633 | Method for providing a metallization layer on an insulating layer and for opening through holes in the said insulating layer using the same mask | Werner Stoffler | 1999-10-12 |
| 5109267 | Method for producing an integrated circuit structure with a dense multilayer metallization pattern | Hans-Joachim Trumpp | 1992-04-28 |
| 5055383 | Process for making masks with structures in the submicron range | Klaus Meissner, Reinhold Muhl, Hans-Joachim Trumpp, Werner Zapka | 1991-10-08 |
| 4980317 | Method of producing integrated semiconductor structures comprising field-effect transistors with channel lengths in the submicron range using a three-layer resist system | Reinhold Muhl, Hans-Joachim Trumpp | 1990-12-25 |