Issued Patents All Time
Showing 76–100 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7606033 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Amanda E. Mikhail | 2009-10-20 |
| 7550840 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof | John L. Colbert, Justin C. Rogers | 2009-06-23 |
| 7535714 | Apparatus and method providing metallic thermal interface between metal capped module and heat sink | — | 2009-05-19 |
| 7530853 | Socket and method for compensating for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda E. Mikhail | 2009-05-12 |
| 7499279 | Cold plate stability | Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Jr. | 2009-03-03 |
| 7486516 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Mark K. Hoffmeyer, Amanda E. Mikhail | 2009-02-03 |
| 7472477 | Method for manufacturing a socket that compensates for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda E. Mikhail | 2009-01-06 |
| 7442053 | Apparatus for restricting rotational moment about a longitudinal axis of SMT connectors | William L. Brodsky, Mark G. Clark, Amanda E. Mikhail, Scott A. Shurson, Jason T. Stoll | 2008-10-28 |
| 7438558 | Three-dimensional stackable die configuration for an electronic circuit board | — | 2008-10-21 |
| 7438557 | Stacked multiple electronic component interconnect structure | Mark D. Plucinski | 2008-10-21 |
| 7382620 | Method and apparatus for optimizing heat transfer with electronic components | Vijayeshwar D. Khanna, Joseph Kuczynski, Sri M. Sri-Jayantha | 2008-06-03 |
| 7354281 | Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors | William L. Brodsky, Mark G. Clark, Amanda E. Mikhail, Scott A. Shurson, Jason T. Stoll | 2008-04-08 |
| 7352575 | Dynamic air moving system | William J. Anderl, Maurice F. Holahan, Gregory S. Vande Corput | 2008-04-01 |
| 7339266 | Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof | John L. Colbert, Justin C. Rogers | 2008-03-04 |
| 7317514 | System and method for optimizing heat management | Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil, Paul Alan Vermilyea | 2008-01-08 |
| 7303443 | Socket and method for compensating for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda E. Mikhail | 2007-12-04 |
| 7298623 | Organic substrate with integral thermal dissipation channels, and method for producing same | Joseph Kuczynski | 2007-11-20 |
| 7214874 | Venting device for tamper resistant electronic modules | John R. Dangler, Phillip Duane Isaacs | 2007-05-08 |
| 7087210 | Single-step simple and economical process for the preparation of nanosized acicular magnetic iron oxide particles of maghemite phase | Jui Chakraborty, Venkatesh Rao | 2006-08-08 |
| 7071720 | Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit | John L. Colbert, Roger Duane Hamilton | 2006-07-04 |
| 7068510 | Dissipating heat reliably in computer systems | Martin Joseph Crippen, Pat Gallarelli, Benjamin Kreuz | 2006-06-27 |
| 6988533 | Method and apparatus for mounting a heat transfer apparatus upon an electronic component | John L. Colbert, Roger Duane Hamilton | 2006-01-24 |
| 6970360 | Tamper-proof enclosure for a circuit card | — | 2005-11-29 |
| 6802733 | Topside installation apparatus for land grid array modules | John L. Colbert, John Saunders Corbin, Jr., Roger Duane Hamilton, Danny E. Massey | 2004-10-12 |
| 6800271 | Process for the preparation of nanosized iron oxide by biomimetic route | Jui Chakraborty, Samar Das, Swapan Das, Venkatesh Rao, Patcha Ramachandra Rao | 2004-10-05 |